化学镀铜溶液中稳定剂的研究-《电镀与精饰》

文章信息/Info

Title:: Researches on Stabilizers in Electroless Copper Plating Bath using Quadrol and EDTA as Complexing Agent

摘要:: 对四羟丙基乙二胺和EDTA双络合剂化学镀铜溶液稳定剂进行研究。用高温大负载施镀实验进行初步筛选,研究了筛选出的稳定剂对沉积速率、镀液稳定性及镀层的影响。结果表明,亚硫酸钠和吐温-60能提高镀液稳定性并能获得较好的镀层。将亚硫酸钠与吐温-60进行组合,可提高镀液稳定性,沉积速率可达7.29μm/h。用线性扫描和交流阻抗的方法对亚硫酸钠和吐温-60提高镀液稳定性的机理进行研究,结果表明,亚硫酸钠主要是与Cu+形成稳定的配合物,而吐温-60则是与Cu0吸附并使其失去催化活性。

Abstract:: In the paper,stabilizers in electroless copper plating bath using Quadrol and EDTA as complexing agent were systematically investigated. Preliminary screening of stabilizer was conducted by plating experiments at high temperature and large loadage. Effects of the selected stabilizers on deposition rate, bath stability and coating performance were characterized. The results showed that tween-60 and sodium sulfite could improve the bath stability and was of benefit to obtaining better coatings. The combination of tween-60 and sodium sulfite could improve the bath stability significantly and the deposition rate could reach to 7. 29 μm / h. Linear sweep voltammetry( LSV) and Electrochemical impedance spectroscopy( EIS) were employed to study the mechanism of sodium sulfite and tween-60 for improving the stability of the plating bath. And the results indicated that sodium sulfite could complex with Cu+whereas tween-60 could adsorb onto the Cu0and consequently made it lost catalytic activity.