JIN Huiyi*,GUAN Minjuan,XU Xiaoping,et al.Study on Electroless Nickel Plating of Non-Noble Metal Ion Activated Silicon Surface[J].Plating & Finishing,2022,(2):36-40.[doi:10.3969/j.issn.1001-3849.2022.02.008]
非贵金属离子活化硅基表面化学镀镍研究
- Title:
- Study on Electroless Nickel Plating of Non-Noble Metal Ion Activated Silicon Surface
- 分类号:
- TQ153.3
- 文献标志码:
- A
- 摘要:
-
分别以 NiCl2 和 CuSO4 试剂作为活化剂，在硅基表面通过化学镀制备镍膜，通过 Tafel 曲线、交流阻抗谱、 SEM 和 SPM 等测试技术研究镀膜的性能。结果表明：镍离子和铜离子均可代替贵金属离子作为活化剂在硅基表面化学镀镍，一次镀膜厚度约 4 ～ 7 μm ，两种活化方法的镀膜覆盖比分别为 98.19 % 和 99.88 % 。从镀膜均匀性、厚度、平整性和光滑性上比较，采用 CuSO4 作为活化剂，其活化性能优于 NiCl2 。
- Abstract:
-
NiCl2 and CuSO4 reagents were used as activation reagents respectively to prepare nickel films by electroless plating on silicon substrates. The coating performance was studied by Tafel curve ， AC impedance spectroscopy ， SEM and SPM. The results showed that both nickel ion and copper ion could replace noble metal ion as activator for electroless nickel plating on the surface of silicon substrate. The thickness of a single coating was about 4‐7 μm ， and the coating coverage ratio of the two activation methods was 98.19% and 99.88 % ， respectively. In terms of coating uniformity ， thickness ， flatness and smoothness ， the activation performance of CuSO4 was better than that of NiCl2.
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备注/Memo
收稿日期： 2021-09-04 修回日期： 2021-11-04 作者简介： 金会义（ 1979 —），男，博士，讲师，研究方向：功能材料制备及应用， email ： tjujin@126.com 基金项目： 天津市企业科技特派员项目（ 20YDTPJC01080 ）