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[1]周苗淼,张 雨,沈喜训,等.芯片电镀铜添加剂的研究进展[J].电镀与精饰,2022,(2):60-65.[doi:10.3969/j.issn.1001-3849.2022.02.013]
 ZHOU Miaomiao,ZHANG Yu,SHEN Xixun,et al.Research Progress of the Copper Electroplating Additives in Chip Manufacturing[J].Plating & Finishing,2022,(2):60-65.[doi:10.3969/j.issn.1001-3849.2022.02.013]
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芯片电镀铜添加剂的研究进展

参考文献/References:



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[26] 王旭 , 张胜涛 , 陈世金 , 等 . 高深径比通孔电镀铜的添加剂优化 [J]. 电镀与涂饰 , 2020, 39(8): 461-468.

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备注/Memo

收稿日期: 2020-10-31 修回日期: 2021-01-08 作者简介: 周苗淼( 1997 —),女,硕士在读, email : 2420984704@qq.com 通信作者: 徐群杰( 1969 —),男,博士研究生,教授, email : xuqunjie@shiep.edu.cn 基金项目: 国家自然科学基金面上项目( 21972090 );上海市科委项目( 19DZ2271100 )

更新日期/Last Update: 2022-01-24