[1]张中宝,许少凡.TiB_2表面镀铜工艺[J].电镀与精饰,2006,(6):34-37.
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TiB_2表面镀铜工艺(
)
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
- 卷:
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- 期数:
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2006年6
- 页码:
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34-37
- 栏目:
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- 出版日期:
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2019-06-07
文章信息/Info
- Title:
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Technology of Copper Plating on Surface of TiB_2 Particles
- 作者:
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张中宝; 许少凡
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合肥工业大学材料科学与工程学院；合肥工业大学材料科学与工程学院
- 分类号:
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TQ153.14
- 摘要:
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利用化学镀覆技术成功在T iB2颗粒表面均匀化学镀覆铜。透射电子显微镜观察表明:通过严格的镀前预处理工艺的优化设计以增加活化点,对传统镀液配方的调整以降低镀速,能够成功地在T iB2颗粒表面镀覆一层铜,从而增强了其和铜基体之间的界面结合力,为T iB2在复合材料领域之中的应用打下了坚实基础。
- Abstract:
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Because of the wetting property between copper matrix and TiB_2 particles being poor,the technology that produces complex powder TiB_2/Cu through electroless copper plating was researched.Observation of TEM images shows that by optimizing the pretreatment process before electroless plating to increase activated sites,and adjusting the traditional composition of copper electroless plating bath to decrease electroless plating rate,a layer of continuous copper on surface of TiB_2 can be successfully coated.Thus the interfacial adhesion between TiB_2 and copper matrix of the composite coating can be increased.
更新日期/Last Update:
2019-06-07