[1]万冰华,杨军,王福新,等.无氰镀镉工艺开发研究与应用[J].电镀与精饰,2014,(3):22-25+46.
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无氰镀镉工艺开发研究与应用(
)
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
- 卷:
-
- 期数:
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2014年3
- 页码:
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22-25+46
- 栏目:
-
- 出版日期:
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2019-06-07
文章信息/Info
- Title:
-
Investigation and Application on Cyanide-free Cadmium Electroplating Technology
- 作者:
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万冰华; 杨军; 王福新; 修文波; 高文
-
航天精工有限公司
- 分类号:
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TQ153.17
- 摘要:
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叙述了无氰镀镉镀液的配方及工艺参数,总结了镀液的配制以及维护经验,分析了镀液的分散能力、深镀能力和沉积速率以及镀层的耐蚀性和氢脆等性能。结果表明,无氰镀镉紧固件电镀产品与传统氰化镀镉电镀产品性能相当,可以取代传统的氰化镀镉工艺。
- Abstract:
-
In this paper,Electrolyte composition and process parameters of cyanide-free cadmium electroplating were specified. Experience of making up and maintenance of the bath were summarized. Throing power and covering power of the bath,electroplating rate as well as corrosion resistance and hydrogen embrittlement of the coating were also analyzed. The results revealed that fastener products obtained by the cyanide-free cadmium electroplating showed considerable performance to that of cyanide cadmium electroplating,which meant that traditional cyanide cadmium plating could be replaced by cyanide- free process in fastener manufacturing.
更新日期/Last Update:
2019-06-07