化学镀镍-磷合金复合稳定剂的优化研究-《电镀与精饰》

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摘要:: 采用正交试验研究了稳定剂硫酸铜、碘酸钾、DL-半胱氨酸和硫酸铈复合使用对化学镀Ni-P合金镀液稳定性、镀速、镀层磷含量和孔隙率等性能的影响变化规律。结果表明,各种稳定剂之间有相互促进作用,综合性能明显优于单一稳定剂,且复合使用采用了清洁的原料,替代了重金属Pb2+;稳定剂硫酸铜、碘酸钾、DL-半胱氨酸和硫酸铈最佳复配的质量浓度分别为:25、20、3和7.5mg/L,镀后测得镀速12.54μm/h、镀液稳定常数91.85%、孔隙率0、镀层磷质量分数为10.25%。

Abstract:: Influences of composite stabilizer( composed by copper sulfate,potassium iodate,DL-cysteine and cerium sulfate) on electroless Ni-P plating stability,plating speed,phosphorus content of Ni-P coating and porosity rate were studied through orthogonal tests. Experimental results showed that: there were mutually reinforcing effects between single stabilizers,the overall performance of composite stabilizer was obviously better the that of single stabilizers. Further more,Pb2 +was replaced in composite stabilizer due to cleaner raw material was used. The optimum combination of stabilizers was: copper sulfate 25 mg / L,potassium iodate 20 mg / L,DL-cysteine 3 mg / L,cerium sulfate 7. 5 mg / L. Plating speed was 12. 54 μm / h,bath stability constant was 91. 85%,coating porosity rate was 0,and phosphorus mass fraction of the coating was 10. 25%.