[1]杨晨,刘定富.DMH对丁二酰亚胺无氰镀银的影响[J].电镀与精饰,2015,(3):28-31.
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DMH对丁二酰亚胺无氰镀银的影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2015年3
页码:
28-31
栏目:
出版日期:
2019-06-07

文章信息/Info

Title:
The impact of DMH on Succinimide Cyanide-free Silver Plating
作者:
杨晨刘定富
贵州大学
分类号:
TQ153.16
摘要:
将5,5-二甲基乙内酰脲(DMH)加入丁二酰亚胺镀银溶液中,考察了DMH的添加量对镀银层外观、光泽度、镀液阴极电流密度上限及沉积速度的影响,采用扫描电镜观察镀层的微观形貌。结果表明,当DMH质量浓度为20 g/L时,可获得结合力、抗变色能力良好,光泽度为232 Gs的镀银层,Jκ上限为0.76 A/dm2,沉积速率为1.263 g/(dm2·h)。
Abstract:
5,5-dimethyl hydantoin( DMH) was added into succinimide cyanide-free sliver plating solution,and influences of DMH dosage on appearance and gloss of the silver coating,upper limit of cathode current density,and deposition speed were investigated. Coating morphology was observed by scanning electron microscopy( SEM). Results showed that when DMH mass concentration was 20 g / L,the silver coating,with good binding force,good anti-tarnishing ability and 232 Gs gloss,could be obtained. The up limit of cathode current density was 0. 76 A / dm2 and the deposition rate was 1. 263 g /( dm2·h).
更新日期/Last Update: 2019-06-07