[1]刘明星,欧忠文,胡国辉,等.无氰镀银新工艺的研究[J].电镀与精饰,2017,(3):13-18.
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无氰镀银新工艺的研究(
)
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
- 卷:
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- 期数:
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2017年3
- 页码:
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13-18
- 栏目:
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- 出版日期:
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2019-06-07
文章信息/Info
- Title:
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Investigation of a New Cyanide-Free Silver Electroplating Process
- 作者:
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刘明星; 欧忠文; 胡国辉; 聂亚林; 缪建峰
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后勤工程学院化学与材料工程系;重庆立道表面技术有限公司;哈密军分区69330部队;73206部队
- 摘要:
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介绍了一种可以产业化应用的无氰镀银新工艺。采用多种测试及表征方法,对镀液稳定性、分散能力及深镀能力等性能进行了测定;对无氰银镀层的外观质量、微观形貌、结合力、可焊性、抗变色性能及导电性等性能与氰化镀银层进行了对比分析。结果表明,无氰镀银新工艺的镀液与镀层性能接近或优于氰化镀银层。
- Abstract:
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A new process of cyanide-free silver electroplating for industrial application was introduced in this paper.Performances of the plating bath,such as stability,throwing power and covering power were determined by series of tests and characterization methods; appearance quality,microstructure,adhesion,solderability,anti-tarnish properties and electrical conductivity of the cyanide-free silver plated coating were analyzed and compared with that of conventional cyanide silver plated coating.Results showed that the properties of plating bath and coating of the new cyanide-free silver plating process were close to or better than those of traditional cyanide silver plating process.
更新日期/Last Update:
2019-06-07