[1]刘月,丁运虎,毛祖国,等.电子封装用免清洗助焊剂的研究进展[J].电镀与精饰,2017,(6):12-16.
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电子封装用免清洗助焊剂的研究进展(
)
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
- 卷:
-
- 期数:
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2017年6
- 页码:
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12-16
- 栏目:
-
- 出版日期:
-
2019-06-07
文章信息/Info
- Title:
-
Research Progress of No-Clean Flux in Electronic Packaging
- 作者:
-
刘月; 丁运虎; 毛祖国; 黄兴林; 王柱元; 黄朝志
-
武汉材料保护研究所
- 分类号:
-
TG42
- 摘要:
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介绍了助焊剂的作用及其分类;总结了免清洗助焊剂的特点、种类和检测方法,介绍了几种新型免清洗助焊剂及其研究进展;对免清洗助焊剂的成分如活化剂、溶剂、表面活性剂和添加剂的功效做了说明,指出了存在的一些问题,并展望了今后的发展方向。
- Abstract:
-
This paper describes the role and the classification of flux briefly; mainly introduces the characteristics,types and test methods of no-clean flux,presents several new types of no-clean flux and the general research progress; illustrates the effect of compositions of no-clean flux,such as activators,solvents,surfactants and other additives. In the end,this paper points out some existing problems and looks ahead the prospect of the development in future.
更新日期/Last Update:
2019-06-07