射流电沉积工艺优化对铜镀层形貌及微观结构的影响-《电镀与精饰》

文章信息/Info

Title:: Influence of Optimization of Jet Electrodeposition Process on the Morphology and Microstructure of Copper Coating

摘要:: 射流电沉积技术具有特殊的定域性和材料特性,可用于磨损机械零件的修复,但因为边缘效应,沉积层的分布均匀性和质量需要改善。考察了沉积形貌、微观结构与射流电沉积电解液流速、喷嘴扫描速度及电流密度等关键参数的关系。结果表明,喷射流速在110 m/s范围,随着流速的增加沉积层表面质量及微观结构逐渐致密;扫描速度在115 mm/s范围,随着速度的加快沉积层表面质量及微观结构逐渐致密;电流密度在100600 A/dm2范围内,随着电流的增大沉积层表面质量及微观结构逐渐改善,晶粒尺寸逐渐增大。

Abstract:: Jet electrodeposition technology possesses special locality and material performance and can be utilized to repair worn mechanical parts. However,the deposition uniformity and quality need to be improved because of the edge effect. The relationship of the deposits surfaces morphology,microstructure and key parameters of jet electrodeposition,such as electrolyte jet flow velocity,nozzle scanning rate,current density were analyzed. The results showed that the deposits surface morphology and microstructure improved with the increase of the flow velocity when the jet velocity was in the range of 1 ~ 10 m/s; When the nozzle scanning rate was in the range of 1 ~ 15 mm/s,the deposits surface morphology and microstructure improved with the increase of the scanning rate; when the current density was in the range of 100 ~600 A/dm~2,the deposits surface morphology and microstructure improved continuously and the grain size increased gradually with the increase of the current density.