[1]邢乾锋,郭钟宁*,罗红平.高聚物介质中电沉积铜的试验研究[J].电镀与精饰,2021,(12):34-37.[doi:10.3969/j.issn.1001-3849.2021.12.007]
　XING Qianfeng,GUO Zhongning*,LUO Hongping.Research on the Process of Electroforming Copper in Polymer Medium[J].Plating & Finishing,2021,(12):34-37.[doi:10.3969/j.issn.1001-3849.2021.12.007]
点击复制

高聚物介质中电沉积铜的试验研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2021年12
页码:
34-37
栏目:
出版日期:
2021-12-15

文章信息/Info

Title:
Research on the Process of Electroforming Copper in Polymer Medium
作者:
邢乾锋; 郭钟宁*; 罗红平
广东工业大学 机电工程学院 省部共建精密电子制造技术与装备国家重点实验室 广州市非传统制造技术及装备重点实验室，广东 广州 510006
Author(s):
XING Qianfeng;  GUO Zhongning*;  LUO Hongping
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment， Guangzhou Key Laboratory of Nontraditional Machining and Equipment， School of Electro-mechanical Engineering，Guangdong University of Technology，Guangzhou 510006， China
关键词:
PAM; 高聚物; 电沉积
Keywords:
PAM high polymer electrodeposition
DOI:
10.3969/j.issn.1001-3849.2021.12.007
文献标志码:
A
摘要:
采用扫描电子显微镜和X射线衍射技术研究以聚丙烯酰胺（PAM）为高分子聚合物介质对硫酸盐镀铜电沉积行为的影响。结果表明，与传统工艺相比，以聚丙烯酰胺为高聚物介质电沉积铜能在较低电压下获得更均匀致密的铜晶粒。在1.0 V电压下，镀层表面主要呈橄榄型锥状，铜镀层的（220）晶面的生长减弱，（111）晶面的生长则增强。
Abstract:
In this paper, scanning electron microscope and X-ray diffraction techniques were used to study the influence of polyacrylamide （PAM） as the polymer medium on the electrodeposition behavior of sulfate copper plating. The results showed that compared with the traditional process, the use of PAM as the polymer medium for copper electrodeposition could obtain more uniform and dense copper crystal grains at a lower voltage. Under 1.0 V voltage, the surface of the plating layer was mainly olive-shaped cone, the growth of the （220） crystal plane of the copper plating layer was weakened, and the growth of the （111） crystal plane was enhanced.

参考文献/References:

[1] 麦永发,朱宏,林建云,等.阳离子聚丙烯酰胺的重要研究技术进展[J]. 高分子通报,2012(8):105-110.
Mai T F, Zhu H, Lin J Y, et al. Important technical progresses of cationic polyacrylamide[J]. Polymer Bulletin, 2012(8): 105-110 (in Chinese).
[2] Fabian C P, Ridd M J, Sheehan M E, et al. Modeling the charge-transfer resistance to determine the role of guar and activated polyacrylamide in copper electrodeposition [J]. Journal of the Electrochemical Society, 2009, 156(10): D400-D407.
[3] 辜敏,杨防祖,黄令,等.高择优取向铜镀层的电化学形成及其表面形貌[J]. 物理化学学报, 2002(11):973-978.
Gu M, Yang F Z, Huang L, et al. The formation of copper electrodeposits with highly preferred orientation and their surface morphology[J]. Acta Physico-Chimica Sinica, 2002(11): 973-978 (in Chinese).

备注/Memo

备注/Memo:
收稿日期： 2019-12-18；修回日期： 2020-03-19
作者简介： 邢乾锋（1994-），硕士研究生，研究方向为特种加工技术，E-mail： 675936684@qq.com
*通信作者： 郭钟宁，教授，博士生导师，E-mail： znguo@gdut.edu.cn
基金项目： 国家自然科学基金（51575113）
更新日期/Last Update: 2021-12-10