[1]寇堂善,周震霄,肖良鸿,等.双金属轴瓦中性镀锡工艺研究[J].电镀与精饰,2021,(12):43-46.[doi:10.3969/j.issn.1001-3849.2021.12.009]
　KOU Tangshan,ZHOU Zhenxiao,XIAO Lianghong,et al.Neutral Tin Plating Process of Bimetal Bearing Bush[J].Plating & Finishing,2021,(12):43-46.[doi:10.3969/j.issn.1001-3849.2021.12.009]
点击复制

双金属轴瓦中性镀锡工艺研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2021年12
页码:
43-46
栏目:
出版日期:
2021-12-15

文章信息/Info

Title:
Neutral Tin Plating Process of Bimetal Bearing Bush
作者:
寇堂善1; 周震霄2; 肖良鸿2; 王雯艳2; 付雅文3; 王克和2*
1.中车大连机车车辆有限公司，辽宁 大连 116021； 2.大连市表面工程协会，辽宁 大连 116021； 3.大连碧城环保科技股份有限公司，辽宁 大连 116600
Author(s):
KOU Tangshan1;  ZHOU Zhenxiao2;  XIAO Lianghong2;  WANG Wenyan2;  FU Yawen3;  WANG Kehe2*
1.CRRC Dalian Co.， Ltd.， Dalian 116021， China；　2.Dalian Surface Engineering Association， Dalian 116021， China；　3.Dalian Betrust Environmental Technology Co.， Ltd.， Dalian 116600， China
关键词:
双金属轴瓦; HEDP络合剂; 中性镀锡
Keywords:
bimetallic bearing bush HEDP complexing agent neutral tin plating
DOI:
10.3969/j.issn.1001-3849.2021.12.009
文献标志码:
A
摘要:
针对双金属轴瓦镀锡工艺要求，开发了中性镀锡工艺，通过理论分析和工艺试验，确定了镀锡溶液成分组成及工艺参数，在轴瓦镀锡生产中得到成功的应用。
Abstract:
According to the requirements of tin plating process for bimetal bearing bush, a neutral tin plating process was developed. Through theoretical analysis and process test, the composition and process parameters of tin plating solution were determined which has been successfully applied in tin plating production of bearing bush.

参考文献/References:

[1] 张允成, 胡如南, 向荣. 电镀手册(第4版)[M]. 北京:国防工业出版社, 2011.
Zhang Y C, Hu R N, Xiang R. Electroplating Manual (4th Edition)[M]. Beijing: National Defense Industry Press, 2011(in Chinese).
[2] 张立茗, 方景礼, 袁国伟. 实用电镀添加剂[S]. 北京:化学工业出版社, 2006
Zhang L M, Fang J L, Yuan G W. Practical Electroplating Additive[S]. Beijing: Chemical Industry Press, 2006(in Chinese).
[3] 张亮生, 王桂香, 张晓红. 电镀添加剂与电镀工艺[M]. 北京:化学工业出版社, 2011
Zhang L S, Wang G X, Zhang X H, Electroplating Additive and Electroplating Process[M]. Beijing: Chemical Industry Press, 2011(in Chinese).
[4] 方景礼. 电镀添加剂理论与应用[M]. 北京:国防工业出版社, 2006.
Fang J L, Theory and Application of Electroplating Additive[M]. Beijing: National Defense Industry Press, 2006(in Chinese).
[5] 石井英雄. 日本电镀指南[M]. 湖南: 湖南科学技术出版社, 1985.
Ishii Hero. Japanese Electroplating Guide[M]. Hunan: Hunan Science and Technology Press, 1985(in Chinese).
[6] 川崎元雄, 小西三郎. 实用电镀[S]. 北京:机械工业出版社, 1984
Kawasaki Motoo, Konishi Saburo, Practical Electroplating[S]. Beijing: China Machine Press, 1984(in Chinese).
[7] 邵性波, 王玉琛. 实用电镀技术.[M]. 北京:国防工业出版社, 1985.
Shao X B, Wang Y S. Practical Electroplating Technology[M]. Beijing: National Defense Industry Press, 1985(in Chinese).
[8] 张景双, 石金声. 电镀溶液与镀层性能测试[M]. 北京:化学工业出版社, 2003
Zhang J S, Shi J S. Electroplating Solution and Performance Test of Plating Layer[M]. Beijing: Chemical Industry Press, 2003(in Chinese).
[9] 李尊础, 吕亮. 表面活性剂性能及应用[M]. 北京:科学出版社, 2008.
Li Z C, Lv L, Performance and Application of Surfactant[M]. Beijing: Science Press, 2008(in Chinese).
[10] 王世荣, 李祥高. 表面活性剂化学[M]. 北京:化学工业出版社, 2011.
Wang S R, Li X G. Surfactant Chemistry[M]. Beijing: Chemical Industry Press, 2011(in Chinese).

备注/Memo

备注/Memo:
收稿日期： 2021-10-28；修回日期： 2021-11-19
第一作者：寇堂善（1960—），男，工程师，k13500749747@163.com
通信作者：王克和（1942—），男，高级工程师，445380098@qq.com
更新日期/Last Update: 2021-12-10