DAI Yue,ZHANG Lin*,LIU Guangmin,et al.Design of Multi-Mode Precise Pulse Electroplating Power Supply System[J].Plating & Finishing,2022,(9):78-85.[doi:10.3969/j.issn.1001-3849.2022.09.014]
多模式精密脉冲电镀电源系统设计
- Title:
- Design of Multi-Mode Precise Pulse Electroplating Power Supply System
- Keywords:
- precision pulse electroplating power supply ; FPGA ; precision electroplating ; full touch screen operation ; pulse waveform without overshoot
- 分类号:
- TP273
- 文献标志码:
- A
- 摘要:
- 针对现有脉冲电镀电源输出脉冲电流波形不稳定,脉冲电流精度不高,难以满足零件精密电镀需求的问题,设计了一种基于 MCU ( Microcontroller Unit )和 FPGA ( Field Programmable Gate Array )体系结构的多模式精密脉冲电镀电源。本电源系统的设计基于全触摸屏操作,提供了便捷的人机交互,可实现关键脉冲电参数的任意设置和调节;提出了在脉冲间隙进行电压调控及自适应动态调节占空比的控制策略,实现了对脉冲电流幅值的任意且稳定地调节,且输出的脉冲波形平滑稳定;提出了桥式 MOSFET 脉冲产生电路设计及多模式脉冲产生控制算法,实现了多种模式的脉冲波形的可靠输出;提出了基于 FPGA 和 AD7985 的高速高精度的数据采集系统,实现了对电流和电压的实时、高速采集。本电源可满足输出脉冲无过冲,无振铃,电流精度达到 10 mA 以内的要求。基于该脉冲电镀电源,测试和分析了不同模式、不同电参数的脉冲波形特点,并且进行了铜基试件的电镀金实验,制备的镀金层致密性好、晶粒尺寸小,可有效满足精密电镀需求。
- Abstract:
- : Aiming at the problem that the pulse current waveform of the existing pulse electroplating power supply is unstable , the pulse current accuracy is not high , and it is difficult to meet the needs of precision electroplating of parts , a multi-mode precision pulse electroplating power supply based on MCU ( Microcontroller Unit ) and FPGA ( Field Programmable Gate Array ) architecture is designed. The design of the power supply system is based on full touch screen operation , provides convenient human-computer interaction , and can realize the arbitrary setting and adjustment of key pulse electrical parameters. A control strategy of voltage regulation and adaptive dynamic regulation of duty cycle in pulse gap is proposed , which realizes the arbitrary and stable regulation of pulse current amplitude , and the output pulse waveform is smooth and stable. The design of bridge MOSFET pulse generation circuit and multi-mode pulse generation control algorithm are proposed to realize the reliable output of multi-mode pulse waveform. A high-speed and high-precision data acquisition system based on FPGA and AD7985 is proposed , which realizes real-time and high-speed acquisition of current and voltage. This power sup ply can meet the requirements of output pulse without overshoot , no ringing , and current accuracy within 10 mA. Based on the pulse electroplating power supply , the pulse waveform characteristics of different modes and different electrical parameters have been tested and analyzed , and the gold electroplating experiment of copper-based specimens has been carried out. The prepared gold plating layer has good compactness and small grain size , which can effectively meet the requirements of precision electroplating needs.
参考文献/References:
[1] Marauska S, Claus M, Lisec T, et al. Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging[J]. Microsystem Technologies, 2013, 19(8):1119-1130.
[2] Saban S B, Darling R B. Multi-element heavy metal ion sensors for aqueous solutions[J]. Sensors & Actuators B Chemical, 1999, 61(1): 128-137.
[3] 吴涛 . 脉冲镀金在半导体激光器中的应用及工艺优化 [J]. 激光与红外 , 2015, 45(6): 631-634.
[4] Oberhammer J, Niklaus F, Stemme G. Sealing of adhesive bonded devices on wafer level[J]. Sensors & Actuators A Physical, 2004, 110(1): 407-412.
[5] 冯慧峤 , 安茂忠 , 杨培霞 , 等 . 无氰镀金工艺的研究 [J]. 电镀与环保 , 2011, 1: 8-11.
[6] Rehrig D. Effect of deposition method on porosity in Au thin films[J]. Plating, 1974, 61(1): 43-46.
[7] Grüner C, Reeck P, Jacobs P P, et al. Gold coated metal nanostructures grown by glancing angle deposition and pulsed electroplating[J]. Physics Letters A, 2018, 382(19): 1287-1290.
[8] 王卿 , 张勇斌 , 陈金明 , 等 . 电流模式对柠檬酸盐体系镀金的影响 [J]. 中国表面工程 , 2019, 32(3): 88-98.
[9] Yin K M. Duplex diffusion layer model for pulse with reverse plating[J]. Surface and Coatings Technology, 1997, 88(l): 162-169.
[10] 雷婷 , 袁心强 , 王成博 , 等 . 双向脉冲参数对金铸层形貌和结构的影响 [J]. 稀有金属材料与工程 , 2016, 45(5): 1257-1263.
[11] 孟庆波 , 齐海东 , 卢帅 , 等 . 脉冲占空比对电沉积 Sn-Ni-Mn 合金镀层的影响 [J]. 湿法冶金 , 2018, 37(2): 160-164.
[12] Chen C Y, Yoshiba M, Nagoshi T, et al. Pulse electroplating of ultra-fine grained Au films with high compressive strength[J]. Electrochemistry Communications, 2016, 67: 51-54.
[13] 杜贵平 , 姜立新 . 电镀电源的现状及展望 [J]. 新技术新工艺 , 2005(6): 68-70.
[14] 侯进 . 浅谈脉冲电镀电源 [J]. 电镀与环保 , 2005, 25(3): 28-31.
[15] 陈妍妍 , 王明彦 , 高忠波 , 等 . 多波形脉冲电镀电源控制系统的研究 [J]. 电镀与环保 , 2004(3): 30-32.
备注/Memo
收稿日期: 2021-11-01 修回日期: 2021-12-12 作者简介: 戴越( 1997 ―),男,硕士研究生, email : daiyue19@gscaep.ac.cn * 通信作者: 张林, email : linzhang0832@163.com 基金项目: 国防科工局项目( NO.JCKY2018212C015 ); 四川省科技厅重点研发项目( NO.2021YFG0374 )?/html>