[1]郑家翀,何 为,陈先明,等.镀镍磷金属片表面处理对电镀铜生长状态影响的研究[J].电镀与精饰,2024,(1):84-80.[doi:10.3969/j.issn.1001-3849.2024.01.013]
　Zheng Jiachong,He Wei,Chen Xianming,et al.Effect of surface treatment on growth state of electroplating copper for nickel-phosphorus plated metal[J].Plating & Finishing,2024,(1):84-80.[doi:10.3969/j.issn.1001-3849.2024.01.013]
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镀镍磷金属片表面处理对电镀铜生长状态影响的研究
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《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2024年1
页码:
84-80
栏目:
出版日期:
2024-01-15

文章信息/Info

Title:
Effect of surface treatment on growth state of electroplating copper for nickel-phosphorus plated metal
作者:
（1.电子科技大学 材料与能源学院，四川 成都 611731； 2.珠海方正科技高密电子有限公司&珠海方正科技多层电路板有限公司，广东 珠海 519175； 3.珠海越亚半导体股份有限公司，
广东 珠海 519175）
Author(s):
（1.School of Materials and Energy， University of Electronic Science and Technology of China，
Chengdu 611731， China； 2.Zhuhai Founder Tech.Hi-Density Electronic Co.， Ltd. & Zhuhai
Founder Technology Multilayer PCB Co.， Ltd.， Zhuhai 519175， China； 3.Zhuhai ACCESS
Semiconductor Co.，Ltd.， Zhuhai 519175， China）
关键词:
表面处理; 电镀铜; 平整性; 镀镍磷金属片
Keywords:
surface treatments ;  copper electroplating ;  flatness ;  nickel-phosphorus plated metal
分类号:
TQ153.1
DOI:
10.3969/j.issn.1001-3849.2024.01.013
文献标志码:
A
摘要:
对镀镍磷金属片进行了微蚀，化学镀铜，微蚀后化学镀铜这三种表面处理，对比了表面处理方法对镀镍磷金属片表面形貌、电镀铜平整性和可靠性的影响。结果表明，化学镀铜处理能够有效提升镀镍磷金属片表面的平整性，提升导电性，得到平整可靠的电镀铜层。化学镀铜处理方法有效解决了在化学镀镍表面直接电镀铜的平整性和可靠性问题，为提升电镀铜平整性和可靠性提供有效手段。
Abstract:
： Three surface treatments ， microetching ， electroless copper plating and electroless copper plating after microetching ， were carried out on the nickel-phosphorous metal. The effects of surface treatments on the surface morphology ， flatness and reliability of electroplated copper were compared. The results show that electroless copper plating can effectively improve the surface flatness and electrical conductivity of nickel-phosphorus plated metal ， and obtain a flat and reliable electroplating copper layer. The electroless copper plating treatment method effectively solves the flatness and reliability issues of direct copper plating on the surface of electroless nickel plating ， providing an effective mean to improve the flatness and reliability of copper plating.

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备注/Memo

备注/Memo:
收稿日期： 2023-03-13 修回日期： 2023-04-20 作者简介： 郑家翀（ 1999 ―），男，硕士研究生， email ： 870706086@qq.com * 通信作者： 陈苑明， email ： ymchen@uestc.edu.cn 基金项目： 国家自然科学基金项目（编号： 61974020 ）；四川省科技计划（编号： 2021ZHCG0002 ）；珠海市创新团队项目（编号： ZH0405190005PWC ）；珠海市科技项目（编号： ZH22017001200032PWC ）?/html>
更新日期/Last Update: 2024-01-07