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[1]吴敏娴,张 然,明智耀,等.doi: 10.3969/j.issn.1001-3849.2025.03.0012硫脲对复合添加剂体系电解制备超低轮廓[J].电镀与精饰,2025,(03):77-82.
　Naotoshi Mitsuzaki,Chen Zhidong*.Effect of thiourea on the performance of ultra-low profile electrolytic copper foil Wu Minxian1,2, Zhang Ran1, Ming Zhiyao1, Wang Wenchang1,2*, Qing Shuiping3,[J].Plating & Finishing,2025,(03):77-82.
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doi: 10.3969/j.issn.1001-3849.2025.03.0012硫脲对复合添加剂体系电解制备超低轮廓

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2025年03 页码: 77-82 栏目: 出版日期: 2025-03-31
Title:
Effect of thiourea on the performance of ultra-low profile electrolytic copper foil Wu Minxian1,2, Zhang Ran1, Ming Zhiyao1, Wang Wenchang1,2*, Qing Shuiping3,
作者:
吴敏娴1; 2; 张 然1; 明智耀1; 王文昌1; 2*; 秦水平3; 光崎尚利3; 陈智栋1; 2*
电解铜箔性能的影响吴敏娴1,2,张 然1,明智耀1,王文昌1,2*,秦水平3,光崎尚利3,陈智栋1,2*(1. 常州大学 石油化工学院,江苏 常州 213164 ;2. 常州大学电解铜箔工程技术中心,江苏 常州 213164;3. 阔智材料科技(常州)
Author(s):
Naotoshi Mitsuzaki 3;  Chen Zhidong1; 2*
(1. School of Petrochemical Engineering, Changzhou University, Changzhou 213164, China; 2. Electrolytic Copper Foil Engineering Technology Center of Changzhou University, Changzhou 213164, China; 3. Qualtec Materials Technology (Changzhou) Co., Ltd., Changzhou 213164, China)
关键词:
中文电解铜箔; 硫脲; 低轮廓; 抗拉强度; 延伸率; 耐腐蚀性
Keywords:
electrolytic copper foil;  thiourea;  low profile;  tensile strength;  elongation;  corrosion resistance
分类号:
TB37
文献标志码:
A
摘要:
电解铜箔是电子制造领域不可或缺的材料之一，随着5G通信技术的快速发展与广泛应用，对电解铜箔的性能提出了更高的要求。除了需要满足“低轮廓”的基础要求，铜箔还需要具有高抗拉强度、高延伸率、高导电性、及良好的耐蚀性等。本文报道了硫脲在由PEG、HP、MESS组成的复合添加剂体系中对电解铜箔性能的影响。利用扫描电镜和粗糙度仪研究了硫脲对铜箔表面粗糙度的影响，结果表明硫脲可有效降低铜箔粗糙度至0.32 μm。拉伸实验结果表明，复合添加剂体系中硫脲的加入有利电解铜箔的抗拉强度(514 MPa)和延伸率(4.57%)的提高。此外，中性模拟海水的动电位极化曲线测试显示硫脲的加入还有效提高了电解铜箔的耐腐蚀性。
Abstract:
Electrolytic copper foil is one of the indispensable materials in the field of electronic manufacturing. With the rapid development and wide application of 5G communication technology, high requirements are put forward for the performance of electrolytic copper foil. In addition to the basic requirements of "low profile", copper foil also needs to have high tensile strength, high elongation, high electrical conductivity, and good corrosion resistance, etc. In this work, the effect of thiourea on the properties of electrolytic copper foil prepared in the electrolytes composed of PEG, HP and MESS was reported. The effect of thiourea on the surface roughness of copper foil was studied by scanning electron microscope and roughness meter, and the results showed that thiourea could effectively reduce the roughness of copper foil to 0.32 μm. The tensile test results showed that the addition of thiourea in the composite additive system was beneficial to the improvement of the tensile strength (514 MPa) and elongation (4.57%) of the electrolytic copper foil. What’s more, the addition of thiourea also effectively improved the corrosion resistance of electrolytic copper foil.

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更新日期/Last Update: 2025-03-18