[1]杜永杰,邓晓明,陈晓丽,等.doi: 10.3969/j.issn.1001-3849.2025.10.001微焊过程中SAC305/单晶铜界面反应行为研究[J].电镀与精饰,2025,(10):1-10.
　Zhou Qi,Wang Yuecong,Wang Jun,et al.Investigation of the reaction behavior between SAC305 and monocrystalline copper during micro-soldering Du Yongjie1,2, Deng Xiaoming1, Chen Xiaoli1, Wang Yuechuan2, Cao Wei3,[J].Plating & Finishing,2025,(10):1-10.
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doi: 10.3969/j.issn.1001-3849.2025.10.001微焊过程中SAC305/单晶铜界面反应行为研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2025年10
页码:
1-10
栏目:
出版日期:
2025-10-31

文章信息/Info

Title:
Investigation of the reaction behavior between SAC305 and monocrystalline copper during micro-soldering Du Yongjie1,2, Deng Xiaoming1, Chen Xiaoli1, Wang Yuechuan2, Cao Wei3,
作者:
杜永杰1; 2; 邓晓明1; 陈晓丽1; 王跃川2; 曹 巍3; 周 琦3; 王悦聪4; 王 军3; 陈苑明3*
(1. 珠海市能动科技光学产业有限公司,广东 珠海 519055 ;2. 四川大学 高分子科学与工程学院,四川 成都 610065 ;3. 电子科技大学 材料与能源学院,四川 成都 610054 ;4. 四川和恩泰半导体有限公司,四川 遂宁629019)
Author(s):
Zhou Qi3;  Wang Yuecong4;  Wang Jun3;  Chen Yuanming3*
(1. Zhuhai Dynamic Technology Optical Industry Co., Ltd., Zhuhai 519055, China; 2. College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China; 3. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China; 4. Sichuan Heentai Semiconductor Co., Ltd., Suining 629019, China)
关键词:
单晶铜; 焊料; 生长动力学; 金属间化合物; 界面反应
Keywords:
monocrystalline copper;  solder;  growth kinetics;  intermetallic compound;  interface reactions
分类号:
TG406
文献标志码:
A
摘要:
微焊过程中Cu焊盘尺寸的减小，导致了微焊点的界面金属间化合物(IMC)占比则相对增大，而Cu的晶向对IMC性能的影响越来越不可忽视。以晶向分别为(111)、(110)和(100)的单晶Cu为金属基底，SAC305为无铅焊料，探究铜晶向对IMC生长行为的影响。采用扫描电子显微镜(SEM)、能量色散X射线谱仪(EDS)以及电子背散射衍射(EBSD)等表征手段，研究了在固-固等温时效下的界面变化和生长动力学以及不同单晶Cu表面所生成的IMC生长的晶向取向特征。结果表明：(110)Cu/SAC305的IMC界面扩散系数最大，其次依次是(100)Cu/SAC305、(111)Cu/SAC305，并发现扩散系数和晶面的致密度呈负相关。在与Cu6Sn5 (-12-10)η晶面平行的单晶铜中，(111)Cu与(100)Cu晶面呈现竞争趋势，受基底Cu晶向影响明显，而(0001)η/(110)Cu始终保持相对的一致性，不受基底Cu晶向影响。
Abstract:
The size reduction of Cu pad during micro-soldering leads to an increase on the proportion of interfacial intermetallic compounds (IMC) in micro-solder joints, so the influence of Cu grain orientation on the IMC performance turns more and more unnoticeable. In order to investigate the effect of Cu grain orientation on IMC growth behavior, single-crystal Cu with grain orientations of (111), (110) and (100), respectively, was used as the metal substrate, and SAC305 solder was used as the brazing alloy. The interfacial changes and growth kinetics under solid-solid isothermal aging as well as the grain orientation features of IMC growth generated on different single-crystal Cu surfaces were investigated by scanning electron microscopy (SEM), energy dispersive X-ray spectrometry (EDS), and electron backscattering diffraction (EBSD) characterization methods. The results showed that the diffusion coefficient of (110) Cu/SAC305 was the largest, sequentially followed by (100) Cu /SAC305 and finally (111) Cu/SAC305, and a negative correlation was found between the diffusion coefficient and the densities of the crystal surfaces. In the single-crystal Cu parallel to the (-12-10)η crystal faces of Cu 6Sn5, the (111) Cu and (100) Cu crystal faces showed a competing trend due to the influence from the crystal orientation of Cu, whereas the (0001)η/(110) Cu always remained relatively coherent with no obvious influence from the crystal orientation of Cu

参考文献/References:

[1].Jiang T, Im J, Huang R, et al. Through-silicon via stress characteristics and reliability impact on 3D integrated circuits[J]. MRS Bulletin, 2012, 40(3): 248-256.
[2].Barik E M, Gillot C, Hodaj F. Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging[J]. Journal of Materials Science. Materials in Electronics, 2022, 54(8): 42-46.
[3].Jun S Y, Bang J, Kim M S, et al. Thermo-compression bonding of Cu/SnAg pillar bumps with electroless palladium immersion gold (EPIG) surface finish[J]. Materials, 2023, 16(24): 342-346.
[4].Kotadia H R, Howes P D, Mannan S H. A review: On the development of low melting temperature Pb-free solders[J]. Microelectronics Reliability, 2014, 54(6): 1253-1273.
[5].Chen C H, Lee B H, Chen H C, et al. Development of new low melting solder alloys[J]. IEEE, 2016, 28(42): 206-210.
[6].Qu S, Shi Q. Hot tear cracks on the suppression of Sn-Bi alloy for low-temperature assembly[J]. Soldering and Surface Mount Technology, 2023, 35(4): 231-243.
[7].Yang M, Li M, Wang C. Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering[J]. Intermetallics, 2012, 25(36): 86-94.
[8].Kotadia H R, Mokhtari O, Clode M P, et al. Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates[J]. Journal of Alloys and Compounds, 2012, 511(1): 176-188.
[9].Liu B, Tian Y, Liu W, et al. TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows[J]. Materials Letters, 2016, 163(15): 254-257.
[10].Gong J, Liu C, Conway P P, et al. Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate[J]. Scripta Materialia, 2009, 60(5): 333-335.
[11].Tang Y, Li G Y, Pan Y C. Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu- xTiO2 solder joints in reflow process[J]. Journal of Alloys and Compounds, 2013, 554: 195-203.
[12].Gong J, Liu C, Conway P P, et al. Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate[J]. Acta Materialia, 2008, 56(16): 4291-4297.
[13].Zhao D, Zhang K, Ma N, et al. Dynamic observation of interfacial IMC evolution and fracture mechanism of Sn2.5Ag0.7Cu0.1RE/Cu lead-free solder joints during isothermal aging[J]. Materials, 2020, 13(4): 4-8.
[14].Zou J, Mo L, Wu F, et al. Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging[C]//11th International Conference on Electronic Packaging Technology and High Density Packaging, 2010: 944-948.
[15].Tian Y, Zhang R, Hang C, et al. Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0 Ag0.5Cu solder joints on different Cu pads[J]. Materials Characterization, 2014, 88: 58-68.
[16].Zou H F, Yang H J, Zhang Z F. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals[J]. Acta Materialia, 2008, 56(11): 2649-2662.
[17].Qiao Y Y, Zhao N, Liu C Y, et al. Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J]. Materials Today Communications, 2020, 23(4-7): 100928.
[18].Qiao Y, Liu X, Zhao N, et al. Morphology and orientation evolution of Cu6Sn5 grains on (001)Cu and (011)Cu single crystal substrates under temperature gradient[J]. Journal of Materials Science and Technology, 2021, 95: 29-39.
[19].张宝权. 共晶无铅合金对Cu、Ag界面金属间化合物形核与生长的影响[D]. 大连: 大连理工大学, 2022.
[20].李绎铃. SAC305钎料与多晶及(111)择优Cu界面反应行为[D]. 大连: 大连理工大学, 2022.
[21].Tu K N, Thompson R D. Kinetics of interfacial reaction in bimetallic Cu-Sn thin films[J]. Acta Metallurgica, 1982, 30(5): 947-952.
[22].Xing Y, Wang S, Fan B, et al. Three-dimensional nano-porous Cu6Sn5/Cu composite from dealloying as anode for lithium ion batteries[J]. Microporous and Mesoporous Materials the Official Journal of the International Zeolite Association, 2018, 46(22): 54-58.
[23].Zhang Z, Cao H, Li M, et al. Three-dimensional placement rules of Cu6Sn5 textures formed on the ( 111)Cu and (001) Cu surfaces using electron backscattered diffraction[J]. Materials and Design, 2016, 94(77): 280-285.
[24].Hodúlová E, Palcut M, Lechovi? E, et al. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X=Bi, In) solders with Cu substrate[J]. Journal of Alloys and Compounds, 2011, 509(25): 7052-7059.
[25].Tay S L, Haseeb A S M A, Johan M R, et al. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate[J]. Intermetallics, 2013, 33: 8-15.

更新日期/Last Update: 2025-10-15