[1]莫敏华*,阮 炜,章正伟,等.doi: 10.3969/j.issn.1001-3849.2025.11.009提高碲化铋基热电材料界面结合强度研究[J].电镀与精饰,2025,(11):67-73.
　Lin Changhong,Wu Yongqing.Study on improving interfacial bonding strength of bismuth telluride based thermoelectric materials Mo Minhua1*, Ruan wei 2, Zhang Zhengwei1, Huang Min1, Yu Laiming1, Qiu Qunlu 1,[J].Plating & Finishing,2025,(11):67-73.
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doi: 10.3969/j.issn.1001-3849.2025.11.009提高碲化铋基热电材料界面结合强度研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2025年11
页码:
67-73
栏目:
出版日期:
2025-11-30

文章信息/Info

Title:
Study on improving interfacial bonding strength of bismuth telluride based thermoelectric materials Mo Minhua1*, Ruan wei 2, Zhang Zhengwei1, Huang Min1, Yu Laiming1, Qiu Qunlu 1,
作者:
莫敏华1*; 阮 炜2; 章正伟1; 黄 敏1; 俞来明1; 裘群禄1; 林长红1; 吴永庆2
(1. 浙江交通职业技术学院 航空学院,浙江 杭州 310000 ;2. 杭州大和热磁电子有限公司,浙江 杭州 310000)
Author(s):
Lin Changhong1;  Wu Yongqing2
(1. Civil Aviation Department, Zhejiang Institute of Communication, Hangzhou 310000, China; 2. Hangzhou Ferrotec Corporation, Hangzhou 310000, China)
关键词:
热电材料; 界面结合强度; 切割方式; 砂纸粒度; 喷镍预处理温度; 腐蚀
Keywords:
thermoelectric materials; interfacial bonding strength; cutting method; sanding paper particle size; pretreatment temperature of nickel spraying; corrosion
分类号:
TQ153
文献标志码:
A
摘要:
针对热电器件界面结合强度不足问题，研究了热电材料切割方式、表面打磨砂纸粒度、喷镍预处理温度、腐蚀液组成等因素对界面结合强度的影响规律。结果表明采用线切割方式制备的样品比内圆切割制备的样品界面结合强度高30%，砂纸打磨宜采用240#或400#，喷镍预处理温度控制在95 ℃左右，采用三元混酸体系腐蚀液腐蚀后镀镍镀锡等方法可以提高界面结合强度。其中N型材料采用含150 g/L硫酸，100 g/L硝酸和100 mL/L 氢氟酸腐蚀2 min后镀镍镀锡样品的界面结合强度与不腐蚀直接镀镍镀锡样品相比提高了34.2%。采用SEM分析了界面断裂位置，结果表明界面结合强度不足部位是半导体表层损伤层。
Abstract:
In response to the problem of insufficient interface bonding strength in thermoelectric devices, the influence of factors such as cutting method of thermoelectric materials, surface sanding paper particle size, nickel spray pretreatment temperature, and etching solution composition on interface bonding strength was studied. The results show that the interfacial bonding strength of the samples prepared by wire cutting is 30% higher than that prepared by internal cutting. It is recommended to use 240# or 400 # sandpaper for polishing, and control the pretreatment temperature of nickel spraying at about 95 ℃. The interfacial bonding strength can be improved by using nickel plating and tin plating after corrosion with ternary mixed acid system etching solution.The interfacial bonding strength of N-type material electroplated nickel and tin samples after etch with 150 g/L sulfuric acid, 100 g/L nitric acid and 100 mL/L hydrofluoric acid for 2 min was increased by 34.2% compared with that of direct nickel and tin plating samples without etching. The fracture location of the interface was analyzed by SEM, and the results showed that the area with insufficient interfacial bonding force was the damaged layer on the surface of the semiconductor

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备注/Memo

备注/Memo:
1 实验方法
更新日期/Last Update: 2025-11-20