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《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:

期数:

2025年11

页码:

85-92

栏目:

出版日期:

2025-11-30

文章信息/Info

Title:

Application process and performance analysis of Au-Sn eutectic solder layered electroplating deposition method

作者:

吴莉莉^1*; 邓永强²; 杨 皓¹; 胡蒙均¹

(1. 重庆工业职业技术大学 机械工程学院,重庆 401120 ;2. 重庆理工大学,重庆 400054)

Author(s):

Wu Lili1*;  Deng Yongqiang2;  Yang Hao1;  Hu Mengjun1

(1. School of Mechanical Engineering, Chongqing Industry Polytechnic University, Chongqing 401120, China; 2. Chongqing University of Technology, Chongqing 400054, China)

关键词:

Au-Sn共晶焊料; 电镀沉积法; 应用工艺; 性能分析; 电镀层; 无氰镀液

Keywords:

Au-Sn eutectic solder;  electroplating deposition method;  application technology;  performance analysis;  plating;  cyanide free plating solution

分类号:

TQ153

文献标志码:

A

摘要:

为提升Au-Sn共晶焊料的焊接质量，需对Au-Sn焊料的成分和厚度进行精确控制。为此，本研究提出一种Au-Sn共晶焊料分层电镀沉积法的应用工艺，并给出相应的性能分析方法。采用Au-DMH作为金主盐、焦磷酸亚锡作为锡主盐，配合亚硫酸钠、焦磷酸钾等络合剂及EDTA、邻苯二酚等添加剂，配制了稳定的无氰Au-Sn共沉积镀液。以表面预镀0.2 μm Au的6英寸晶圆硅片作为共晶焊料的基体，利用双脉冲电流工艺进行分层电镀沉积，控制Au-Sn原子比为80∶20，总厚度为1.5～2.0 μm。通过控制不同的电流密度，依次进行种子层沉积和分层电镀沉积，得到Au-Sn共晶焊料分层电镀样品，厚度达到目标值。性能测试表明，镀液在加入锡酸钠后20 d内阴极极化曲线无明显变化，显示出良好的稳定性。电镀层显微组织结构层次分明，Sn元素均匀分布，Au元素有序沉积。镀层表面由均匀分布的细小颗粒组成，平整度和一致性显著提高。峰值电流密度对Sn含量影响显著，15 mA/cm2时Sn含量约为13～20 at.%，45 mA/cm2时Sn含量稳定在35～40 at.%。结合力测试显示，镀层在60 d内未出现脱离现象。耐腐蚀性测试表明，镀层在浓盐酸溶液中浸泡50 d后质量损失未突破预设上限值，显示出优异的耐腐蚀性能。

Abstract:

To improve the welding quality of Au-Sn eutectic solder, precise control of the composition and thickness of Au-Sn solder is required. Therefore, this study proposes an application process of Au-Sn eutectic solder layer electroplating deposition method and provides corresponding performance analysis methods. A stable cyanide free Au-Sn codeposition plating solution was prepared using Au DMH as the gold main salt and stannous pyrophosphate as the tin main salt, combined with chelating agents such as sodium sulfite and potassium pyrophosphate, as well as additives such as EDTA and catechol. A 6-inch silicon wafer pre plated with 0.2 μm Au on the surface was used as the substrate for eutectic solder. Layered electroplating deposition was carried out using a dual pulse current process, with an Au Sn atomic ratio controlled at 80∶20 and a total thickness of 1.5-2.0 μm. By controlling different current densities, seed layer deposition and layered electroplating deposition were sequentially carried out to obtain Au Sn eutectic solder layered electroplating samples with a thickness reaching the target value. Performance tests showed that the cathodic polarization curve of the plating solution did not change significantly within 20 days after the addition of sodium stannate, demonstrating good stability. The microstructure of the electroplated layer is clearly layered, with uniform distribution of Sn element and orderly deposition of Au element. The surface of the coating is composed of uniformly distributed fine particles, which significantly improves the flatness and consistency. The peak current density has a significant impact on the Sn content. At 15 mA/cm2, the Sn content is about 13-20 at.%, and at 45 mA/cm2, the Sn content remains stable at 35-40 at.%. The adhesion test showed that the coating did not detach within 60 days. The corrosion resistance test showed that the quality loss of the coating did not exceed the preset upper limit after soaking inconcentrated hydrochloric acid solution for 50 days, demonstrating excellent corrosion resistance performance

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更新日期/Last Update: 2025-11-20