[1]宋一凡,李嘉欣,赵金鑫,等.doi: 10.3969/j.issn.1001-3849.2026.02.010DMF-C2H5OH-H2O体系中DMF含量对ABS-PC膨润效果的影响[J].电镀与精饰,2026,(02):81-93.
　LI Haoxian,MA Fengbiao,ZHAO Wei.Influence of DMF content on swelling effects of ABS-PC in DMF-C 2H5OH-H2O system SONG Yifan1,2, LI Jiaxin1,2, ZHAO Jinxin3, YUAN Manyan1,2, ZHANG Yuanjing1,2, ZHAO Wenxia1,2,[J].Plating & Finishing,2026,(02):81-93.
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doi: 10.3969/j.issn.1001-3849.2026.02.010DMF-C2H5OH-H2O体系中DMF含量对ABS-PC膨润效果的影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年02
页码:
81-93
栏目:
出版日期:
2026-02-28

文章信息/Info

Title:
Influence of DMF content on swelling effects of ABS-PC in DMF-C 2H5OH-H2O system SONG Yifan1,2, LI Jiaxin1,2, ZHAO Jinxin3, YUAN Manyan1,2, ZHANG Yuanjing1,2, ZHAO Wenxia1,2,
作者:
宋一凡1; 2; 李嘉欣1; 2; 赵金鑫3; 袁满艳1; 2; 张源晶1; 2; 赵文霞1; 2; 李昊贤1; 2; 马凤飚4; 赵 伟5
(1. 宁夏师范大学 化学化工学院,宁夏 固原 756099 ;2. 宁夏回族自治区绿色催化材料与技术重点实验室,宁夏 固原756099;3. 山东医学高等专科学校,山东 济南 276000 ;4. 宁夏回族自治区固原市第一中学,宁夏 固原 756000 ;5. 中国科学院金属研究所,辽宁 沈阳 110016 )
Author(s):
LI Haoxian1; 2;  MA Fengbiao4;  ZHAO Wei5
(1. College of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756099, China; 2. Key Laboratory of Green Catalytic Materials and Technology, Ningxia Hui Autonomous Region, Guyuan 756099, China; 3. Shandong Medical College, Jinan 276000, China; 4. Ningxia Guyuan No.1 Middle School, Guyuan 756000, China; 5. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China)
关键词:
ABS-PC共聚物; 膨润; 亲水性; 剥离强度
Keywords:
ABS-PC copolymer;  swelling;  hydrophilicity;  adhesion strength
分类号:
TQ153
文献标志码:
A
摘要:
针对聚丙烯腈-丁二烯-苯乙烯-聚碳酸酯(ABS-PC)共聚物表面与金属镀层剥离强度较小的现象，解决ABS-PC基板表面亲水性较差和表面粗糙度较小的问题，采用N, N-二甲基甲酰氨(DMF)-乙醇(C2H5OH)-水(H2O)体系作为ABS-PC基板的膨润体系，研究了35 ℃下膨润体系中DMF体积分数及膨润时间对ABS-PC基板膨润效果的影响。实验过程中采用KMnO4-H2SO4-H2O体系作为ABS-PC基板的微蚀体系，H2O与H2SO4的体积比为1﹕2，KMnO4含量为30 g/L，微蚀温度为60 ℃，微蚀时间为25 min。研究结果表明：当膨润温度为35 ℃，膨润体系中DMF体积分数为80%，膨润时间为5 min时，膨润及微蚀处理后ABS-PC基板表面形成了致密的大小均匀的孔洞，表面粗糙度增大。且ABS-PC基板表面C元素含量降低，O元素含量升高，这是由于膨润和微蚀处理后ABS-PC基板表面生成了–C=O和–COOH两种亲水性基团，其表面亲水性得到大幅度提升。在较大的表面粗糙度和较强的表面亲水性的共同作用下，ABS-PC基板表面与镀铜层之间剥离强度达到0.81kN/m，满足工业生产中剥离强度大于0.70 kN/m的要求。
Abstract:
In view of the phenomenon that the adhesion strength between the surface of polyacrylonitrile- butadiene-styrene-polycarbonate (ABS-PC) copolymer and the electroless copper plating layer is relatively low. To solve the problems of poor surface wettability and low surface roughness of the ABS-PC substrate, the N, N- dimethylformamide (DMF) - ethanol (C 2H5OH) - water (H2O) system was employed as the swelling system for the ABS-PC substrate. The effects of the DMF volume fraction in the swelling system and the swelling time on the swelling effect of ABS-PC at 35 °C were investigated. KMnO4-H2SO4-H2O system was used as the etching system for ABS-PC substrate under the conditions of the volume ratio of water to sulfuric acid of 1﹕2, with KMnO4 content of 30 g/L, etching temperature of 60 °C, and etching time of 25 min. The results indicate that dense pores with uniform sized are formed on the surface of the ABS-PC substrate surface after swelling and etching treatments, accompanied by an increase in surface roughness when the swelling temperature is 35 °C, the DMF volume fraction in the swelling system is 80%, and the swelling time is 5 min. Furthermore, the content of C element on the surface of the ABS-PC substrate decreased, while that of O element increased, and the surface hydrophilicity is enhanced, which is attributed to two hydrophilic groups, –C=O and –COOH, being generated on the ABS-PC substrate surface, significantly improving the wettability of the ABS-PC substrate surface. Under the combination effects of high surface roughness and strong surface hydrophilicity, the adhesion strength between the ABS-PC substrate surface and the electroless copper plating layer reached to 0.81 kN/m, meeting the adhesion strength requirement of 0.70kN/m in the industrial production
更新日期/Last Update: 2026-02-09