[1]阎 艳,黄斐斐,郝嘉慧,等.doi: 10.3969/j.issn.1001-3849.2026.03.003高稳定性无氰巯基磺酸盐金电镀液及镀层制备[J].电镀与精饰,2026,(03):22-27.
 YAN Yan,HUANG Feifei,HAO Jiahui,et al.Preparation of gold electroplating bath and coating in high stability cyanide-free mercaptan-sulfonate[J].Plating & Finishing,2026,(03):22-27.
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doi: 10.3969/j.issn.1001-3849.2026.03.003高稳定性无氰巯基磺酸盐金电镀液及镀层制备()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年03
页码:
22-27
栏目:
出版日期:
2026-03-31

文章信息/Info

Title:
Preparation of gold electroplating bath and coating in high stability cyanide-free mercaptan-sulfonate
作者:
阎 艳1黄斐斐2郝嘉慧1任 婧1黄明亮1
(1. 大连理工大学 材料科学与工程学院,辽宁 大连 116081 ;2. 大连理工大学 化学学院,辽宁 大连 116081)
Author(s):
YAN Yan1 HUANG Feifei2 HAO Jiahui1 REN Jing1 HUANG Mingliang1
(1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116081, China; 2. School of Chemical Engineering, Dalian University of Technology, Dalian 116081, China)
关键词:
电镀金无氰电镀液巯基磺酸盐稳定性金镀层耐腐蚀性能
Keywords:
gold electroplating cyanide-free bath mercaptan-sulfonate stability gold coating corrosion resistance
分类号:
TQ153.1
文献标志码:
A
摘要:
剧毒性氰化物络合体系金电镀液难以满足绿色制造的需求,环保型无氰络合体系成为必然的发展趋势。针对无氰主络合剂与金离子络合强度弱,易导致金电镀液失稳、金镀层晶粒粗大疏松等问题。对比研究以3-巯基-1-丙磺酸盐(MPS)、亚硫酸盐(SO32)、5,5-二甲基乙内酰脲(DMH)作为主络合剂的3种络合体系金电镀液的阴极极化行为,结合金镀层形貌与耐腐蚀性能,阐明络合体系对金电镀液稳定性及金镀层性能的影响。结果表明:MPS与金离子的络合强度显著高于SO32和DMH,以其作为主络合剂的金电镀液在室温下可稳定储存6个月,并且获得具有镜面级金色光泽表面、致密的纳米级细晶粒形貌及优异耐腐蚀性能的金镀层。Au-MPS络合体系金电镀液可以在长期使用中保持络合物的单一稳定性,满足工业化应用对电镀液(稳定性≥6个月)及金镀层(优异性能与高重现性)的要求。
Abstract:
Cyanide-based gold electroplating baths fall short of green manufacturing requirements due to high toxicity, making the development of environmentally friendly cyanide-free alternatives. However, cyanide-free complexing agents exhibit weak coordination strength with gold ions, resulting in bath instability and coarse, loose-grained gold coatings. The cathodic polarization behavior of three types of gold electroplating baths utilizing 3-mercapto-1-propanesulfonate (MPS), sulfite (SO 32) and 5,5-dimethylhydantoin (DMH) as primary complexing agents were studied respectively. The morphology and corrosion resistance of gold coatings were examined, thereby clarifying the influence of the complexing system on bath stability and coating properties. The results show that MPS exhibits greater coordination strength with gold ions than SO32 and DMH. Therefore, the MPS-based gold electroplating baths remain stable at room temperature for up to 6 months, producing mirror-bright gold coatings characterized by dense nanoscale grains and excellent corrosion resistance. The MPS-based gold electroplating baths maintain long-term complex stability, meeting industrial requirements for both bath durability and coating performance. The baths exhibit stability for over six months, while consistently producing coatings with excellent properties and high reproducibility

参考文献/References:

[1].朱晶. 电子工业中电沉积金镀层的应用与发展[J]. 表面技术, 2018, 47(3): 256-261.
[2].刘建祥, 安茂忠, 浦建堂, 等. 电镀金工艺的研究与应用现状[J]. 材料保护, 2020, 53(8): 113-116.
[3].孙林, 谢新根, 程凯, 等. 脉冲电镀参数对薄膜电路镀金层性能的影响[J]. 电镀与涂饰, 2018, 37(13): 566-569.
[4].OSAKA T, OKINAKA Y. Development of new electrolytic and electroless gold plating processes for electronics applications[J]. Science and Technology of Advanced Materials, 2006, 7(5): 425-437.
[5].方景礼. 电镀配合物—理论与应用[M]. 北京: 化学工业出版社, 2008, 115-122.
[6].DIMITRIJEVIC S, TRUJIC V. Non-cyanide electrolytes for gold plating: A review[J]. International Journal of Electrochemical Science, 2013, 8(5): 6620-6646.
[7].NICOLAS I M, DANESC A. Comparative studies regarding cyanide and sulphite electrolytes for brush electroplating of gold thin films[J]. UPB Scientific Bulletin, Series B, 2020, 82(1): 3-14.
[8].YANG J Q, JIN L, LI W Q, et al. Electrodeposition mechanism and process of a novel cyanide-free gold sulfite bath[J]. Journal of Electrochemistry, 2022, 28(7): 2213005.
[9].PETUKHOV I V, POPOVA A M, KICHIGIN V I. Electrochemical processes in sulfite gold plating solutions and some properties of gold coatings[J]. Eurasian Journal of Chemistry, 2023, 4(112), 75-81.
[10].OYAIZU K, OHTANI Y, SHIOZAWA A, et al. Highly stable gold(III) complex with a hydantoin ligand in alkaline media[J]. Inorganic Chemistry, 2005, 44(20): 6915-6917.
[11].HUANG M L, HUANG F F, Study on co-electrodeposition mechanism of Au-30at.% Sn eutectic in non-cyanide bath by electrochemical methods[J]. Journal of the Electrochemical Society, 2017, 164(7): D445-D450.
[12].HUANG F F, HUANG M L. Complexation behavior and co-electrodeposition mechanism of Au-Sn alloy in highly stable non-cyanide bath[J]. Journal of the Electrochemical Society, 2018, 165(3): D152-D159.
[13].黄明亮, 黄斐斐, 刘亚伟. 一种无氰Au-Sn合金镀液及其制备方法和应用: 中国, 105780071B[P]. 2018-05-04.
[14].REN X F, SONG Y, LIU A M, et al. Experimental and theoretical studies of DMH as a complexing agent for a cyanide-free gold electroplating electrolyte[J]. RSC Advances, 2015, 5(80): 64997-65004.
[15].付银辉, 李元朴, 董东. 亚硫酸钠-柠檬酸钾体系络合剂对镀金层性能的影响[J]. 表面技术, 2023, 52(4): 390-398.
[16].AYERS P W. An elementary derivation of the hard/soft-acid/base principle[J]. The Journal of Chemical Physics, 2005, 122(14); 141102.
[17].阳岸恒, 裴洪营, 邓志明, 等. 电镀软金用硫基无氰金配合物电解质研究进展[J]. 贵金属, 2021, 42(1): 88-97.
[18].黄明亮, 黄斐斐, 阎艳, 等. 一种巯基磺酸无氰镀金电镀液及其制备方法与应用: 中国, 119736676A[P]. 2025-04-01.
[19].黄明亮, 阎艳, 黄斐斐, 等. 一种无氰Au-Sn电镀液与应用: 中国, 119736680B[P]. 2025-04-01.

更新日期/Last Update: 2026-03-11