[1]侯利亚,张德良,任志军,等.doi: 10.3969/j.issn.1001-3849.2026.03.004电解退镀对引线框架镀银区域性能影响[J].电镀与精饰,2026,(03):28-34.
　HOU Liya,ZHANG Deliang,REN Zhijun,et al.Effects of electrolytic stripping on performance of silver-plated areas in lead frames[J].Plating & Finishing,2026,(03):28-34.
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doi: 10.3969/j.issn.1001-3849.2026.03.004电解退镀对引线框架镀银区域性能影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年03
页码:
28-34
栏目:
出版日期:
2026-03-31

文章信息/Info

Title:
Effects of electrolytic stripping on performance of silver-plated areas in lead frames
作者:
侯利亚; 张德良; 任志军; 朱 林; 杨永学; 黄 伟
(新恒汇电子股份有限公司,山东 淄博 255000)
Author(s):
HOU Liya;  ZHANG Deliang;  REN Zhijun;  ZHU Lin;  YANG Yongxue;  HUANG Wei
(Henghui Technology Co., Ltd., Zibo 255000, China)
关键词:
电解退镀; 可键合性; 统计学检验; 回归分析
Keywords:
electrolytic stripping;  bondability;  statistical testing method;  regression analysis
分类号:
TQ153.1；TG14
文献标志码:
A
摘要:
针对引线框架生产过程中镀银品质的改善，为解决电解退镀导致引线框架镀银区域品质恶化的问题，采用试验验证、统计学检验与回归分析的方法，研究了电解退镀的电流密度对镀银厚度、结晶性、百倍形貌、微观表面形貌以及可键合性的影响。结果表明：电流密度未对银镀层的厚度和结晶性产生显著性影响，但当电流密度超过2.0 A?dm?2时会破坏镀银层的微观形貌，达到3.0 A?dm?2时会影响镀银层二焊点的可键合性，导致二焊点拉力值降低，报警率升高。
Abstract:
To improve the silver plating quality during the production of lead frames and address the issue of deteriorated silver plating quality in lead frame regions caused by electrolytic stripping. The experimental validation, statistical testing, and regression analysis were employed to investigate the effects of electrolytic stripping current density on silver plating thickness, crystallinity, hundredfold morphology, microstructure and bonding capability. The results indicate that the current density has no significant effect on the thickness and crystallinity of the silver coating. However, when the current density exceeds 2.0 A?dm?2, it will damage the micromorphology of the silver coating. When it reaches 3.0 A?dm?2, it will affect the bondability of the second solder joint of the silver coating, resulting in a decrease in the tensile strength of the second solder joint and an increase in the alarm rate.

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更新日期/Last Update: 2026-03-11