无氰镀银研究进展
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
卷:
期数:
2006年6
页码:
18-21
栏目:
出版日期:
2019-06-07
- Title:
- Research Progress in Cyanide-free Silver Plating
- 分类号:
- TQ153.16
- 摘要:
- 综述了十种典型的无氰镀银工艺配方和无氰镀银所采用的添加剂类型。根据使用不同的络合剂,无氰镀银可分为硫代硫酸盐镀银、亚硫酸盐镀银、甲基磺酸镀银、丁二酰亚胺镀银、烟酸镀银等;无氰镀银通常采用的无机添加剂主要是可溶性金属化合物,有机添加剂主要是非离子型表面活性剂、聚胺类化合物、含氮杂环化合物、含硫化合物和氨基酸化合物等。
- Abstract:
- Ten typical formulas and some kinds of additives used for cyanide-free silver plating were introduced.Cyanide-free silver plating can be classified as: thiosulfate silver plating,sulphite silver plating,methylsulfnicacid silver plating,succimide silver plating,niacin silver plating,etc. based on the complexant used.The inorganic additives are soluble metal compounds,and the organic additives are nonionic surfactants,polyamine compounds,nitrogen heterocyclic compounds,sulfur compounds,amino acid compounds,etc.
更新日期/Last Update:
2019-06-07