LU Shuai,GUO Zhao,QI Haidong,et al.Effect of Thiourea on the Electrodeposition Behavior of Sn?Ni Alloy[J].Plating & Finishing,2019,(1):22-26.[doi:10.3969/j.issn.1001-3849.2019.01.005]
硫脲对Sn?Ni合金电沉积行为的影响
- Title:
- Effect of Thiourea on the Electrodeposition Behavior of Sn?Ni Alloy
- Keywords:
- electrodeposition behavior; thiourea; Sn?Ni alloy
- 分类号:
- TQ153.2
- 文献标志码:
- A
- 摘要:
- 采用极化曲线、循环伏安、交流阻抗和电位阶跃电化学方法，研究了硫脲（TU）浓度对Sn?Ni合金电沉积行为的影响。结果表明，硫脲的加入可以减弱阴极极化，促进金属离子的沉积，并且随着硫脲浓度的增加，去极化作用增强；加入硫脲不改变Sn?Ni合金的电结晶成核机制，仍然按连续成核方式进行。
- Abstract:
- Effect of thiourea concentrationon on the electrodeposition behavior of Sn?Ni alloy was investigated by polarization curve, cyclic voltammetry, AC impedance and potential step electrochemical methods. The results show that thiourea can weaken the cathodic polarization and promote the deposition of metal ions, and with the increase of thiourea concentration, the depolarization effect is enhanced; thiourea does not change the nucleation mechanism of the electrocrystallization of Sn?Ni alloy, and it is still carried out according to the progressive nucleation mode.
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备注/Memo
收稿日期： 2018-08-28
修回日期： 2018-08-30
基金项目： 基金项目:国家自然科学基金资助项目（51774142）