FANG Shu,HE Huan,YE Tao,et al.Effect of Auxiliary Complexing Agent on Cyanide Free Electroplating Cu-Zn Alloy[J].Plating & Finishing,2019,(6):18-22.[doi:10.3969/j.issn.1001-3849.2019.06.004]
辅助络合剂对无氰电镀Cu-Zn合金的影响
- Title:
- Effect of Auxiliary Complexing Agent on Cyanide Free Electroplating Cu-Zn Alloy
- Keywords:
- sodium potassium tartrate; copper-zinc alloy; assistant complexing agent; potassium oxalate; lactic acid
- 文献标志码:
- A
- 摘要:
- 本文以沉积电流密度、电流效率、光泽度以及镀层表面形貌等为评价指标,研究了六种辅助络合剂对酒石酸钾钠体系电镀Cu-Zn合金的影响。结果表明,六种络合剂均可扩展沉积电流密度上、下限,其中草酸钾和乳酸对酒石酸钾钠体系电镀Cu-Zn合金的影响最为明显,前者明显改善电流效率及镀层光泽度,后者明显扩展沉积电流密度上、下限。二者浓度为30 g/L时,均可获得整平性较好的Cu-Zn合金镀层。
- Abstract:
- In this paper, the influence of six kinds of assistant complexing agent on the deposited Cu-Zn alloy in sodium potassium tartrate system were studied based on the deposition current density, current efficiency, gloss and microscopic surface morphology of the coating. The results showed that the six assistant complexing agents could extend the upper and lower limits of deposition current density of Cu-Zn alloy. Among the six agents, potassium oxalate and lactic acid showed the most obvious effect on the electroplating of Cu-Zn alloy in sodium potassium tartrate system. The potassium oxalate could improve the current efficiency and gloss of the alloy, and the lactic acid could expand the limit of deposition current density obviously. The Cu-Zn alloys with the smooth morphology could be obtained when the concentration of potassium oxalate and lactic acid is 30 g/L respectively.
参考文献/References:
[1] 屠振密. 电镀合金原理与工艺[M]. 北京:国防工业出版社, 1993.
[2] 屠振密, 李宁, 安茂忠, 等.电镀合金实用技术[M]. 北京:国防工业出版社, 2007.
[3] 邹忠利, 李宁, 王殿龙, 等.钢铁基体无氰碱性镀铜的研究进展[J]. 电镀与环保, 2008, 2:9-13
[4] 韦公远.几种仿金电镀工艺[J]. 企业技术开发, 1999, 11:28-29.
[5] Thomson D W. Gold alloy plating compositions and method[P]. US Patent 4179344. 1979.
[6] Abbott C N. Zinc-copper alloy electroplating baths[P]. US Patent 3930965. 1976.
[7] 何丽芳, 郭忠诚.无氰仿金电镀的研究现状[J]. 电镀与涂饰, 2006, 3:51-54.
[8] 孙宗海.在草酸盐溶液内电镀黄铜的研究[J]. 化学世界, 1952, 1:8-9.
[9] 梁均方.焦磷酸盐仿金电镀的研究[J]. 嘉应大学学报, 2003, 3:33-35.
[10] 苏静康.关于铜锡锌焦磷酸盐仿金工艺的探讨[J]. 电镀与环保,1986, 4:16-20+7-8.
[11] 谢定陆, 隋贤栋, 罗艳归.Cu-Zn合金的研究现状及其进展[J]. 材料导报, 2011, 25(S1):497-499+503.
[12] 梁成浩, 余向飞.电镀仿金工艺的研究进展[J]. 电镀与环保, 2008, 4:1-4.
[13] 方景礼, 庄瑞舫, 周伯和, 等. 无氰仿金电镀液[P]. CN 86105831 A. 1988.
[14] Higuchi Y, Oga Y, Mizuguchi S. Corrosion-resistant coating on steels[P]. JPO Patent 612003886A, 1986.
[15] 余向飞. 无氰Cu-Zn合金电镀工艺研究[D]. 大连:大连理工大学,2008.
[16] 杨防祖,宋维宝,黄令, 等.钢铁基体酒石酸盐碱性无氰镀铜[J]. 电镀与精饰,2009,31(6):1-4+20.
[17] 张海冬,吴继勋,卢燕平,等.酒石酸盐体系镀黄铜的研究[J]. 材料保护,1993, 3:14-17+3.
[18] 余向飞,梁成浩.无氰Cu-Zn合金仿金电镀工艺[J]. 电镀与涂饰,2008, 11:8-10.
[19] 张颖,王晓轩,陶珍东, 等.玻璃钢饰面技术——无氰二元仿金电镀工艺研究[J]. 工程塑料应用,1994, 6:17-20.
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备注/Memo
收稿日期: 2018-10-25;修回日期: 2018-12-02
基金项目: 2015贵州省科技计划(黔科合GZ字[2015]3010);2017贵州大学研究生创新基金(研理工2017003)