WANG Mingliang,YANG Haiyan,LI Ming,et al.Research Progress on Hard Gold Electrodeposition[J].Plating & Finishing,2019,(11):26-34.[doi:10.3969/j.issn.1001-3849.2019.11.007]
电镀硬金的研究现状
- Title:
- Research Progress on Hard Gold Electrodeposition
- Keywords:
- hard gold; electroplating; wear resistance; contact resistance
- 文献标志码:
- A
- 摘要:
- 硬金镀层由于具有高硬度、高耐磨性和优异的耐蚀性在电子器件和黄金饰品上受到广泛应用。本文概括了电镀硬金的基本原理，总结了钴硬金、镍硬金和无添加硬金等三种常见硬金镀层的电镀工艺及其研究进展，并对其硬度、耐磨性、接触电阻和孔隙率等性能进行综合评价，最后阐述了电镀硬金在电子和装饰领域的应用现状。
- Abstract:
- Electroplating of hard gold layers are widely used in electronic devices and gold jewelry, owing to their premium hardness, wear resistance and anti-corrosion properties. In this paper, the basic principle of electroplating hard gold was summarized. The research progress of cobalt hard gold, nickel hard gold and additive free hard gold in three different aspects including electroplating process, properties (i.e. hardness, wear resistance, contact resistance and porosity) and applications in electronics and decoration were also reviewed.
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备注/Memo
收稿日期： 2019-09-11；修回日期： 2019-09-28
通信作者： 杭弢，email：hangtao@sjtu.edu.cn
基金项目： 国家自然科学基金（21972091）；国家科技重大专项（2017ZX02519001）