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[1]王明亮,杨海燕,李 明,等.电镀硬金的研究现状[J].电镀与精饰,2019,(11):26-34.[doi:10.3969/j.issn.1001-3849.2019.11.007]
 WANG Mingliang,YANG Haiyan,LI Ming,et al.Research Progress on Hard Gold Electrodeposition[J].Plating & Finishing,2019,(11):26-34.[doi:10.3969/j.issn.1001-3849.2019.11.007]



[1] Dimitrijevic S, Rajcic-Vujasinovic M, Trujic V. Non-cyanide electrolytes for gold plating - a review [J]. International Journal of Electrochemical Science, 2013, 8(5): 6620-6646.
[2] Wilkinson P. Understanding gold plating [J]. Gold Bulletin, 1986, 19(3): 75-81.
[3] Kohl P A. Electrodeposition of gold [M]. John Wiley & Sons, Inc., 2011.
[4] Nakahara S. Inclusions in electroplated additive-free hard gold [J]. Journal of the Electrochemical Society, 1981, 128(2): 284-288.
[5] 方景礼. 电镀配合物:理论与应用 [M]. 北京: 化学工业出版社, 2008.
[6] Okinaka Y, Hoshino M. Some recent topics in gold plating for electronics applications [J]. Gold Bulletin, 1998, 31(1): 3-13.
[7] Corti C, Holliday R. Gold science and applications [M]. CRC Press, 2012.
[8] Eisenmann E T. Kinetics of the electrochemical reduction of dicyanoaurate [J]. Journal of the Electrochemical Society, 1978, 125(5): 717-723.
[9] Bindra P. The efect of base metal ions on the electrochemical and structural characteristics of electrodeposited gold films [J]. Journal of the Electrochemical Society, 1989, 136(12): 3616-3626.
[10] Mac Arthur D M. A study of gold reduction and oxidation in aqueous solutions [J]. Journal of the Electrochemical Society, 1972, 119(6): 672-677.
[11] Bozzini B, Mele C, Romanello V. Time-dependent in situ SERS study of CN- adsorbed on gold [J]. Journal of Electroanalytical Chemistry, 2006, 592(1): 25-30.
[12] Liang D, Zangari G. Underpotential codeposition of Au-Ni alloys: the influence of applied potential on phase separation and microstructure [J]. Journal of the Electrochemical Society, 2016, 163(12): D3020-D3026.
[13] Abrahams S C, Zyontz L E, Bernstein J L. Cobalt cyanoaurate: crystal structure of a component from cobalt‐hardened gold electroplating baths [J]. The Journal of Chemical Physics, 1982, 76(11): 5458-5462.
[14] Holmbom G. Incorporation of gold cyanide in electrodeposited gold [J]. Journal of the Electrochemical Society, 1988, 135(3): 787-788.
[15] Antler M. Gold plating for the electronics industry [J]. Gold Bulletin, 1975, 8(3): 86-87.
[16] Lo C C, Augis J A, Pinnel M R. Hardening mechanisms of hard gold [J]. Journal of Applied Physics, 1979, 50(11): 6887-6891.
[17] Li Y G, Lasia A. Nucleation and crystal growth in gold electrodeposition from acid solution Part II: Hard gold [J]. Journal of Applied Electrochemistry, 1996, 26(8): 853-863.
[18] Datta M, Osaka T, Schultze J W. Microelectronic packaging [M]. Florida: CRC press, 2004.
[19] Okinaka Y. “Polymer” inclusions in cobalt-hardened electroplated gold [J]. Journal of the Electrochemical Society, 1978, 125(11): 1745-1750.
[20] Inoue K, Sasaki N, Sasadaira T, et al. The Relationship between microstructure and the thermal equilibrium diagram of Au-Co alloy electrodeposit [J]. Materials Transactions, 2006, 47(6): 1546-1549.
[21] Cohen R L. Characterization of cobalt-hardened gold electrodeposits by Mo?ssbauer spectroscopy [J]. Journal of the Electrochemical Society, 1979, 126(9): 1608-1618.
[22] Monev M, Pfund A, Beck G, et al. Effect of current density on composition and structure of electrodeposited Au-Co alloy coatings [J]. Transactions of the IMF, 2013, 90(6): 305-310.
[23] Liljestrand L G, Sjogren L, Revay L, et al. Wear resistance of electroplated nickel-hardened gold [J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985, 8(1): 123-128.
[24] Yamachika N, Musha Y, Sasano J, et al. Electrodeposition of amorphous Au-Ni alloy film [J]. Electrochimica Acta, 2008, 53(13): 4520-4527.
[25] Togasaki N, Okinaka Y, Homma T, et al. Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications [J]. Electrochimica Acta, 2005, 51(5): 882-887.
[26] Inoue T, Sato K, Yokoshima T, et al. Microstructure of electrodeposited nano-crystalline Au-Ni alloy films [J]. Ecs Transactions, 2011, 33(37): 27-34.
[27] Yokoshima T, Takanaka A, Hachisu T, et al. Mechanical and electrical properties of Au-Ni-C alloy films produced by pulsed current electrodeposition [J]. Journal of the Electrochemical Society, 2013, 160(11): D513-D518.
[28] Kato M, Senda K, Musha Y, et al. Electrodeposition of amorphous gold alloy films [J]. Electrochimica Acta, 2007, 53(1): 11-15.
[29] Reinheimer H A. Carbon in gold electrodeposits [J]. Journal of the Electrochemical Society, 1974, 121(4): 490-500.
[30] Okinaka Y. Structure of electroplated hard gold observed by transmission electron microscopy [J]. Journal of the Electrochemical Society, 1976, 123(9): 1284-1289.
[31] Kato M, Okinaka Y. Some recent developments in non-cyanide gold plating for electronics applications [J]. Gold Bulletin, 2004, 37(1-2): 37-44.
[32] Dimitrijevi? S, Raj?i?-Vujasinovi? M, Alagi? S, et al. Formulation and characterization of electrolyte for decorative gold plating based on mercaptotriazole [J]. Electrochimica Acta, 2013, 104(1): 330-336.
[33] Luo G, Li D, Yuan G, et al. Communication—a cyanide-free electrolyte for hard gold (Au-Co) electrodepositing utilizing DMH as complexing agent [J]. Journal of the Electrochemical Society, 2018, 165(3): D107-D109.
[34] Ren X, An M. Theoretical and experimental studies of the influence of gold ions and DMH on cyanide-free gold electrodeposition [J]. RSC Advances, 2018, 8(5): 2667-2677.
[35] 杜岩滨, 李卫平, 朱立群, 等. 钴离子和镍离子用量对电镀硬金层显微硬度和电接触性能的影响 [J]. 电镀与涂饰, 2019, 38(13): 637-640.
[36] De Doncker R, Vanhumbeeck J. Cobalt in gold electrodeposits [J]. Transactions of the IMF, 2017, 63(1): 59-63.
[37] Cels J P, Roos J R, Van Vooren W, et al. Cobalt hardened gold layers for electrical connectors: Optimization of wear properties [J]. Transactions of the IMF, 2017, 67(1): 70-72.
[38] Okinaka Y. Significance of inclusions in electroplated gold films for electronics applications [J]. Gold Bulletin, 2000, 33(4): 117-127.
[39] Antler M. Sliding wear of metallic contacts [J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981, 4(1): 15-29.
[40] Antler M. Gold plated contacts: effect of thermal aging on contact resistance [M]. Electrical Contacts - 1997 Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts. 1997: 121-131.
[41] Schubert R. Secondary ion mass spectrometric analysis of cobalt-hardened gold electroplate surfaces [J]. Journal of the Electrochemical Society, 1981, 128(1): 126-131.
[42] Song J, Wang L, Zibart A, et al. Corrosion protection of electrically conductive surfaces [J]. Metals, 2012, 2(4): 450-477.
[43] 刘正伟. 硬金镀层的研究进展 [J]. 电镀与精饰, 2011, 33(7): 13-17.
[44] Monev M, Bretzler R, Tatchev D, et al. Nanosized structural features of electrodeposited Au-Co and Au-Ni alloy coatings [J]. Transactions of the IMF, 2017, 95(5): 255-260.
[45] Liu Z, Zheng M, Hilty R D, et al. Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold [J]. Journal of the Electrochemical Society, 2010, 157(7): D411-D416.
[46] Liu Z, West A C. Modeling of galvanostatic pulse and pulsed reverse electroplating of gold [J]. Electrochimica Acta, 2011, 56(9): 3328-3333.
[47] Liu Z, Zheng M, Hilty R D, et al. The effect of pulse reversal on morphology of cobalt hard gold [J]. Electrochimica Acta, 2011, 56(5): 2546-2551.
[48] Byoun Y M, Noh Y T, Kim Y G, et al. Characterization of pulse reverses electroforming on hard gold coating [J]. J Nanosci Nanotechnol, 2018, 18(3): 2104-2108.
[49] 杨防祖, 黄令, 姚士冰, 等. 钯及其合金的电沉积 [J]. 电镀与精饰, 2002, 24(2): 20-27.
[50] 杜中文. 首饰用千足硬金综述 [J]. 超硬材料工程, 2010, 22(2): 54-57.
[51] 冯丽芸, 郄素琴. 解惑硬金技术之殇 [J]. 中国黄金珠宝, 2012, 12(5): 72-75.
[52] 袁军平, 李卫, 王昶, 等. 电铸硬千足金饰品变形问题探讨 [J]. 电镀与涂饰, 2012, 31(1): 26-29.


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收稿日期: 2019-09-11;修回日期: 2019-09-28
通信作者: 杭弢,email:hangtao@sjtu.edu.cn
基金项目: 国家自然科学基金(21972091);国家科技重大专项(2017ZX02519001)

更新日期/Last Update: 2019-11-10