[1]包志华,郭艳红,田志斌,等.一种镍基底上连续镀铜层电解退镀剂的开发[J].电镀与精饰,2020,(4):28-31.[doi:10.3969/j.issn.1001-3849.2020.04.0060]
　BAO Zhihua,GUO Yanhong,TIAN Zhibin,et al.Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate[J].Plating & Finishing,2020,(4):28-31.[doi:10.3969/j.issn.1001-3849.2020.04.0060]
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一种镍基底上连续镀铜层电解退镀剂的开发()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2020年4
页码:
28-31
栏目:
出版日期:
2020-04-15

文章信息/Info

Title:
Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate
作者:
包志华; 郭艳红; 田志斌; 邓正平
广州三孚新材料科技股份有限公司，广东 广州 510000
Author(s):
BAO Zhihua;  GUO Yanhong;  TIAN Zhibin;  DENG Zhengping
Guangzhou Sanfu New Materials Technology Co.,Ltd., Guangzhou 510000, China
关键词:
退镀; 连续镀; 镍基底退铜; 腐蚀
Keywords:
plating stripping continuous plating stripped copper on nickel corrosion
DOI:
10.3969/j.issn.1001-3849.2020.04.0060
文献标志码:
A
摘要:
研制开发了一种镍基底上连续镀铜层的电解退镀剂，通过正交实验得到最优复配方案为：络合剂A 80 g/L、络合剂B 25 g/L、络合剂C 40 g/L、导电盐60 g/L、缓蚀剂2 g/L、抑雾剂0.2 g/L。此工艺用于镍基底上连续镀铜层的阳极电解退除，退镀速度可达1 μm/min，且不腐蚀镍基底，可保持镍层的光亮度。
Abstract:
An electrolytic stripping agent for continuous copper plating on nickel substrate was developed, the optimal compound scheme was obtained through orthogonal experiment with the complexing agent A concentration of 80 g/L, complexing agent B 25 g/L, complexing agent C 40 g/L, conductive salt 60 g/L, corrosion inhibitor 2 g/L and antifogging agent 0.2 g/L. The stripping agent was used for electrolytic stripping of copper coating on nickel substrate, the stripping speed could reach 1 μm/min. In addition, the nickel substrate could avoid corrosion and maintain the brightness.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期： 2019-03-15；修回日期： 2019-04-01
通讯作者： 包志华，男，学士，中级工程师，研究方向为铝合金电镀及连续镀，Email：84117234@qq.com
更新日期/Last Update: 2020-04-10