[1]刘晓东,朱晴晴,李宵宵,等.316L不锈钢带卷镀铜厚度不均匀性研究[J].电镀与精饰,2023,(3):68-74.[doi:10.3969/j.issn.1001-3849.2023.03.010]
　Liu Xiaodong,Zhu Qingqing,Li Xiaoxiao,et al.Study on thickness inhomogeneity of winding-plating copper layer on 316L stainless steel strip[J].Plating & Finishing,2023,(3):68-74.[doi:10.3969/j.issn.1001-3849.2023.03.010]
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316L不锈钢带卷镀铜厚度不均匀性研究
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《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2023年3
页码:
68-74
栏目:
出版日期:
2023-03-15

文章信息/Info

Title:
Study on thickness inhomogeneity of winding-plating copper layer on 316L stainless steel strip
作者:
（上海应用技术大学 化学与环境工程学院，上海 201418）
Author(s):
（School of Chemical and Environmental Engineering， Shanghai Institute of Technology， Shanghai 201418， China）
关键词:
316L 不锈钢; 卷镀; 镀铜; 厚度; 不均匀性
Keywords:
316L stainless steel ;  winding-plating ;  copper plating ;  thickness ;  inhomogeneity
分类号:
TQ153
DOI:
10.3969/j.issn.1001-3849.2023.03.010
文献标志码:
A
摘要:
本文研究了对 316L 不锈钢带进行除油、同槽活化镀镍预处理后，以卷绕方式电镀铜工艺中，改变极间距、电流密度、采用仿形阳极等措施对镀层表面形貌和厚度分布不均匀性的影响。结果表明，在两侧放置铜板做阳极的情况下，镀铜层厚度随极间距的增加而减薄，并按照卷绕圈数呈波动变化。采用仿形阳极后，厚度波动情况缓解。镀铜层厚度均匀性的影响因素按照影响大小依次排序为：阳极形状 > 极间距 > 电流密度。经过改进的卷绕镀铜工艺较佳参数为：预镀镍极间距 4 cm ，双镍板阳极，电流密度 2 A/dm 2 ，温度 40 o C ；镀铜极间距 3 cm 、双仿形磷铜阳极，电流密度 2 A/dm 2 ，室温。电镀 20 min 时镀层厚度极差和标准差为 8.06 μ m 和 1.61 μ m ，远低于改进前的 37.42 μ m 和 8.27 μ m ，镀层厚度不均匀性得到改善。
Abstract:
： 316L stainless steel strips were winding-plated with acid copper solution after degreasing ， co-tank activation and nickel pre-plating. The morphology and thickness characteristics of copper layer were investigated with changing electrode distance ， current density and profile anode. The results show that the thickness of copper coating decreases with the increase of electrode distance and fluctuates cyclically as two copper anode plates are placed at the two sides. The influencing factors of coating thickness uniformity are as follows ： anode shape > electrode distance > current density. The optimized parameters of the copper winding-plating process are as follows ： pre-nickel electrode distance of 3 cm ， double nickel plate anode ， current density of 2 A/dm 2 ， temperature of 40 o C ； copper electrode distance of 3 cm ， double profiled anode of phosphor copper anode ， current density of 2 A/dm 2 ， room temperature. At 20 min for copper plating ， the coating thickness range and standard deviation are 8.06 μ m and 1.61 μ m ， which are much lower than 37.42 μ m and 8.27 μ m before improvement.

参考文献/References:



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备注/Memo

备注/Memo:
收稿日期： 2022-06-11 修回日期： 2022-07-05 作者简介： 刘晓东（ 1998 —），男，硕士研究生， email ： 1554900321@qq.com 通信作者： 王振卫，副教授，研究方向工业镀涂层技术领域的研究， email ： wangzhenwei@sit.edu.c
更新日期/Last Update: 2023-02-20