[1]徐铭孝,战充波,张司琪,等. 丁二酰亚胺对低共熔溶剂中银成核机理的影响 [J].电镀与精饰,2024,(3):34-38.[doi:10.3969/j.issn.1001-3849.2024.03.005]
　Xu Mingxiao,Zhan Chongbo,Zhang Siqi,et al.Effect of succinimide on the nucleation mechanism of silver in deep eutectic solvents[J].Plating & Finishing,2024,(3):34-38.[doi:10.3969/j.issn.1001-3849.2024.03.005]
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丁二酰亚胺对低共熔溶剂中银成核机理的影响
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《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2024年3
页码:
34-38
栏目:
出版日期:
2024-03-15

文章信息/Info

Title:
Effect of succinimide on the nucleation mechanism of silver in deep eutectic solvents
作者:
（1.沈阳理工大学 环境与化学工程学院，辽宁 沈阳 110159； 2.新东北电气集团高压开关 有限公司，辽宁 沈阳 110027）
Author(s):
（1.School of Environmental and Chemical Engineering， Shenyang Ligong University， Shenyang 110159， China； 2.Northeast Electric Group High-Voltage Switch Co.， Ltd.， Shenyang 110027， China）
关键词:
低共熔溶剂; 银镀层; 电沉积行为; 丁二酰亚胺
Keywords:
deep eutectic solvents ;  silver coating ;  electrodeposition behavior ;  succinimide
分类号:
TQ153.16
DOI:
10.3969/j.issn.1001-3849.2024.03.005
文献标志码:
A
摘要:
本文采用循环伏安法（ CV ）和计时电流法（ CA ）考察了在有无丁二酰亚胺添加的条件下低共熔溶剂（ DESs ）中银的结晶成核机理；利用扫描电子显微镜（ SEM ）和 X 射线衍射仪（ XRD ）观察镀液浓度变化对镀层微观形貌以及相组成的影响。计时电流的结果表明，丁二酰亚胺的加入使 Ag 的结晶方式发生改变， Ag 在 DESs-0.6 mol/L 丁二酰亚胺和 0.1 mol/L AgNO 3 中电结晶过程是受扩散控制的三维连续成核。随着丁二酰亚胺的加入，镀层表面 Ag 结晶更加细致，结晶度增大，并且银镀层耐腐蚀性能得到提高。
Abstract:
： Cyclic voltammetry （ CV ） and chronoamperometry （ CA ） were used to investigate the nucleation mechanism of silver in deep eutectic solvents （ DESs ） with or without the addition of succinimide. Scanning electron microscopy （ SEM ） and X-ray diffraction （ XRD ） were applied to observe the effect of plating solution concentration on the microstructure and phase composition of the coating. The results of chronoamperometry showed that the addition of succinimide changed the crystallization mode of Ag ， and the process of Ag crystallization in DES-0.6 mol/L succinimide and 0.1 mol/L AgNO 3 was three- dimensional continuous nucleation controlled by diffusion. With the addition of succinimide ， the surface Ag crystallization of the coating becomes finer ， the crystallinity increases ， and the corrosion resistance of the silver coating are improved.

参考文献/References:



[1] Christophe J, Guilbert G, Q Rayée, et al. Cyanide-free silver electrochemical deposition on copper and nickel[J]. Journal of The Electrochemical Society, 2018, 165(14): 676-680.

[2] Lin Z B, Xie B G, Tian J H, et al. Potential-dependent adsorption of uracil on a silver electrode in alkaline solutions[J]. Journal of Electroanalytical Chemistry, 2009, 636(1-2): 74-79.

[3] Oliveira G M D, Silva M R, Carlos I A. Voltammetric and chronoamperometric studies of silver electrodeposition from a bath containing HEDTA[J]. Journal of Materials Science, 2007, 42(24): 10164-10172.

[4] Tsai M C, Zhuang D X, Chen P Y. Electrodeposition of macroporous silver films from ionic liquids and assessment of these films in the electrocatalytic reduction of nitrate[J]. Electrochimica Acta, 2010, 55(3): 1019-1027.

[5] 于兰天 , 胡劲 . 电流密度对硫代硫酸盐电镀银镀层影响的研究 [J]. 热加工工艺 , 2017, 46(4): 168-171.

[6] Liu A, Ren X, An M, et al. A combined theoretical and experimental study for silver electroplating[J]. Scientific Reports, 2014, 4(5): 3837.

[7] Basile A, Bhatt A I, Anthony P O, et al. An investigation of silver electrodeposition from ionic liquids: Influence of atmospheric water uptake on the silver electrodeposition mechanism and film morphology[J]. Electrochimica Acta, 2011, 56(7): 2895-2905.

[8] Qian H X, Sun J, Li Q S, et al. Electrochemical mechanism of trivalent chromium reduction ChCl-EG deep eutectic solvents containing trivalent chromium. Journal of The Electrochemical Society, 2020 (167): 102511

[9] Qian H X, Li Q S, Sun J, et al. Characterization and analysis of chromium coating electrodeposited on brass in ChCl-EG deep eutectic solvent[J]. International Journal of Electrochemical Science, 2020(15): 8960-8970.

[10] 张润佳 , 战充波 , 孙海静等 . ChCl-EG 低共熔溶剂体系中 Cr(Ⅲ) 的电化学还原反应过程研究 [J]. 材料保护 , 2022, 55(11): 9-13, 158.

[11] 付旭 , 李奇松 , 钱慧璇 , 等 . 氯化胆碱 - 尿素低共熔溶剂中电沉积银 [J]. 电镀与涂饰 , 2021, 40(13): 987-989.

[12] Sun H J, Wang H, Yang S, et al. An analytical study on the electrochemical behavior and nucleation mechanism of a Zn-Ni alloy in a choline chloride-urea deep eutectic solvent[J]. Chemistry Select, 2022, 7(38): e202201899.

[13] Abedin S, Moustafa E M, Hempelmann R, et al. Additive free electrodeposition of nanocrystalline aluminium in a water and air stable ionic liquid[J]. Electrochemistry Communications, 2005, 7(11): 1111-1116.

[14] Alvarez A E, Salinas D R. Nucleation and growth of Zn on HOPG in the presence of gelatine as additive[J]. Journal of Electroanalytical Chemistry, 2004, 566(2): 393-400.

[15] Lin Z B, Xie B G, Chen J S, et al. Nucleation mechanism of silver during electrodeposition on a glassy carbon electrode from a cyanide-free bath with 2-hydroxypyridine as a complexing agent[J]. Journal of Electroanalytical Chemistry, 2009, 633(1): 207-211.

[16] He P, Liu H, Li Z Y, et al. Electrochemical deposition of silver in room-temperature ionic liquids and its surface-enhanced Raman scattering effect effect[J]. Langmuir: The ACS Journal of Surfaces and Colloids, 2004, 20(23):10260-10267.

[17] Hills F, Pour A K, Scharifker B. The formation and properties of single nuclei[J]. Electrochimica Acta, 1983, 28(7): 891-898.

[18] Hills G J, Schiffrin D J, Thompson J. Electrochemical nucleation from molten salts-I. Diffusion controlled electrodeposition of silver from alkali molten nitrates [J]. Electrochimica Acta, 1974, 19(11): 657-670.

[19] Ju H Y, Won M K, Jong K P, et al. Control of the preferred orientations of Cu(In,Ga)Se 2 films and the photovoltaic conversion efficiency using a surface-functionalized molybdenum back contact[J]. Progress in Photovoltaics: Research and Applications, 2014, 22(1): 69-76.

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备注/Memo

备注/Memo:
收稿日期： 2023-06-09 修回日期： 2023-07-02 作者简介： 徐铭孝（ 1998 ―），男，硕士研究生， email ： 1508935675@qq.com 通信作者： 孙杰， email ： jiersun2000@126.com 基金项目： 沈阳理工大学高水平成果建设项目（ SYLUXM202105 ）；沈阳理工大学科研创新团队支持项目 （ SYLUTD202004 ）；水改性低共熔溶剂中 Zn-Ni 合金的可控制备及电沉积机理研究（ LJKMZ20220598 ）
更新日期/Last Update: 2024-02-27