[1]杨宏涛.doi: 10.3969/j.issn.1001-3849.2026.02.003气相缓蚀剂2-苯基咪唑在电路导电金属铜中的缓蚀性能[J].电镀与精饰,2026,(02):27-36.
 YANG Hongtao.Corrosion inhibition performance of 2-phenylimidazole vapor phase inhibitor on conductive metal copper in circuits[J].Plating & Finishing,2026,(02):27-36.
点击复制

doi: 10.3969/j.issn.1001-3849.2026.02.003气相缓蚀剂2-苯基咪唑在电路导电金属铜中的缓蚀性能()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年02
页码:
27-36
栏目:
出版日期:
2026-02-28

文章信息/Info

Title:
Corrosion inhibition performance of 2-phenylimidazole vapor phase inhibitor on conductive metal copper in circuits
作者:
杨宏涛
(河南对外经济贸易职业学院 智能制造学院,河南 郑州 450000)
Author(s):
YANG Hongtao
(College of Intelligent Manufacturing, Henan Institute of International Business and Economics, Zhengzhou 450000, China)
关键词:
2-苯基咪唑缓蚀性能腐蚀介质复配
Keywords:
2-phenylimidazole copper corrosion inhibition performance corrosive media built
分类号:
TG174.42;TQ153
文献标志码:
A
摘要:
研究2-苯基咪唑(2-PhI)作为气相缓蚀剂在电路导电金属铜中的缓蚀性能,探讨其在不同腐蚀介质及温度条件下的缓蚀效果以及与有机胺复配后的性能提升情况。通过失重法和电化学法(极化曲线、交流阻抗谱)对2-PhI在盐酸、氯化钠和硫酸钠溶液中的缓蚀性能进行测试;改变2-PhI浓度(0、50、100、150、200和250 mg/L)、温度(25、40和55 ℃)及复配比例(2-PhI与三乙醇胺质量比为1﹕1、1﹕2和2﹕1等),分析各因素对缓蚀性能的影响。随着2-PhI浓度增加,铜片腐蚀失重、腐蚀速率降低,缓蚀效率提升,250 mg/L浓度下在盐酸、氯化钠、硫酸钠介质中的缓释效率分别可达95.49%、86.46%和87.72%;不同介质中缓蚀性能为盐酸>氯化钠>硫酸钠;温度升高使腐蚀速率增加、缓蚀效率降低;2-PhI与三乙醇胺复配后缓蚀效果增强,1﹕2复配比例时在盐酸溶液中缓蚀效率达86.89%,且在不同温度下均展现更高缓蚀效率。2-PhI对铜具有显著的缓蚀作用,其缓蚀效果受浓度、介质类型和温度影响,与三乙醇胺复配可进一步提高缓蚀性能,有助于提升电路导电金属铜腐蚀防护的效果。
Abstract:
This paper investigates the corrosion inhibition performance of 2-phenylimidazole (2-PhI) as a gas-phase inhibitor in conductive metal copper. It explores its corrosion inhibition effect under different corrosive media and temperature conditions, as well as the performance improvement when combined with organic amines. The corrosion inhibition performance of 2-PhI in hydrochloric acid, sodium chloride and sodium sulfate solutions was tested by the weight loss method and electrochemical methods, such as polarization curve and alternating current impedance spectrum. The concentrations of 2-PhI (0, 50, 100, 150, 200, 250 mg/L), temperatures (25, 40, 55 ℃), and compound ratios (the mass ratios of 2-PhI to tritthanolamine were 1 ﹕1, 1﹕2, 2﹕1, etc.) were analyzed with the influence of each factor on the corrosion inhibition performance. With the increasing of 2-PhI concentration, the weight loss due to copper sheet corrosion, the corrosion rate decrease, and the corrosion inhibition efficiency increases. At a concentration of 250 mg/L, the slow-release efficiencies in hydrochloric acid, sodium chloride, and sodium sulfate media can reach 95.49%, 86.46%, and 87.72%, respectively. The corrosion inhibition performance in different media, such as hydrochloric acid is greater than sodium chloride, and which is in turn greater than sodium sulfate. The increasing of temperature leads to increasing of the corrosion rate and decreasing of the corrosion inhibition efficiency. The corrosion inhibition effect is enhanced when 2-PhI is compounded with triethanolamine. When compounded at a ratio of 1﹕2, the corrosion inhibition efficiency in hydrochloric acid solution reaches 86.89%, and it shows higher corrosion inhibition efficiency at different temperatures. 2-PhI has a significant corrosion inhibition effect on copper. Its corrosion inhibition effect is affected by concentration, medium type and temperature. When compounded with triethanolamine, the corrosion inhibition performance can be further improved, which is more helpful to enhance the corrosion protection effect of copper, a conductive metal in circuits

参考文献/References:

[1].郭叙言, 庄普誉, 吴尚澄, 等. 铜缓蚀剂及其与硅烷复合自组装膜耐腐蚀性能[J]. 表面技术, 2024, 53(14): 106-115.
[2].冯礼奎, 程一杰, 宋小宁, 等. 1,2,4-三唑在模拟调相机转子内冷却水中对铜的缓蚀作用[J]. 中国腐蚀与防护学报, 2024, 44(3): 772-780.
[3].刘欣, 何一鹏, 田旭, 等. 红壤模拟液中单宁酸对铜的缓蚀作用[J]. 腐蚀与防护, 2024, 45(7): 36-42.
[4].郑沛峰, 何晓桐, 邓正平, 等. 苯并三氮唑与非离子型表面活性剂对铜的协同缓蚀作用研究[J]. 电镀与涂饰, 2025, 44(1): 92-95.
[5].R?U?? D I, MATEI E, AVRAMESCU S M. Recent development of corrosion inhibitors: Types, mechanisms, electrochemical behavior, efficiency, and environmental impact[J]. Technologies, 2025, 13(3): 103-142.
[6].孟妮, 张祥龙, 李相辉, 等. BTA与TT-LYK对铜CMP缓蚀效果和协同效应研究[J]. 润滑与密封, 2024, 49(2): 89-97.
[7].吴兆键, 幸豪, 贾晗涛, 等. 苯并三氮唑-季铵盐体系缓蚀处理对铜耐腐蚀和抑菌性能的影响[J]. 电镀与涂饰, 2023, 42(3): 66-71.
[8].连宇博, 张庆祝, 韩创辉, 等. 一种基于MOFs与BTA的纳米缓蚀胶囊对铜的缓蚀行为研究[J]. 中国腐蚀与防护学报, 2022, 42(6): 1058-1064.
[9].王静, 高宝红, 刘世桐, 等. IC铜布线抛光及后清洗中缓蚀剂BTA吸附及去除的研究进展[J]. 电镀与涂饰, 2022, 41(3): 203-210.
[10].卢爽, 刘琳, 谢锦印, 等. 2-氨基苯并咪唑缩对甲基苯甲醛席夫碱的合成及缓蚀性能[J]. 材料导报, 2021, 35(20): 20195-20199.
[11].魏晓静, 翟双岭, 石鑫, 等. 铜氨络合物对二乙基羟胺除氧缓蚀性能的影响[J]. 上海交通大学学报, 2022, 56(6): 818-826.
[12].GUO X, WANG C, FU H, et al. Rust prevention property of a new organic inhibitor under different conditions[J]. Materials, 2024, 17(9): 2168-2183.
[13].高朝卿, 王晨, 陈胤伯, 等. 自组装Cu6Sn5超疏水冶金结合界面的构筑及其在铜缓蚀中的应用[J]. 材料工程, 2021, 49(8): 120-126.
[14].向枫, 吴道新, 匡尹杰, 等. PCB酸性蚀刻液中不同缓蚀剂对铜蚀刻的影响及模拟计算研究[J]. 表面技术, 2021, 50(5): 281-288.
[15].Zeng C, Zhou Z Y, Mai W J, et al. Exploration on the corrosion inhibition performance of Salvia miltiorrhiza extract as a green corrosion inhibitor for Q235 steel in HCl environment[J]. Journal of Materials Research and Technology, 2024, 32(1): 3857-3870.
[16].王业飞, 王婧, 杨华, 等. 新型稠杂环季铵盐的合成及其酸化缓蚀性能[J]. 中国石油大学学报(自然科学版), 2025, 49(2): 189-195.
[17].杜永杰, 丘梓炜, 王红平, 等. 含巯基杂环化合物在酸性蚀刻液中的缓蚀性能研究[J]. 电镀与精饰, 2025, 47(3): 53-59.
[18].陈明锴, 李全德, 倪荣, 等. 水基金属清洗剂的清洁性能及缓蚀行为研究[J]. 电镀与涂饰, 2024, 43(11): 100-108.
[19].武峥, 牛新环, 何潮, 等. 集成电路CMP中金属腐蚀复配缓蚀剂的研究进展[J]. 半导体技术, 2025, 50(1): 1-9.

相似文献/References:

[1]冒爱荣,姚 瑶,陈 亮,等.表面活性剂增感-火焰原子吸收光谱法测定痕量铜[J].电镀与精饰,2022,(1):6.[doi:10.3969/j.issn.1001-3849.2022.01.002]
 MAO Airong YAO Yao CHEN Liang CAI Zhaosheng*.Determination of Trace Copper by Flame Atomic Absorption Spectrometry with Surfactant Sensitization[J].Plating & Finishing,2022,(02):6.[doi:10.3969/j.issn.1001-3849.2022.01.002]
[2]刘井坤,欧阳义波,段体岗,等.复合流体涂层用于Cu金属的防腐蚀研究[J].电镀与精饰,2023,(11):46.[doi:10.3969/j.issn.1001-3849.2023.11.007]
 Liu Jingkun,Ouyang Yibo,et al.Compositing fluid infused surface on Cu for corrosion inhibition[J].Plating & Finishing,2023,(02):46.[doi:10.3969/j.issn.1001-3849.2023.11.007]

更新日期/Last Update: 2026-02-09