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[1]蒲 帅*,张 进,黎 帅.化学镀不溶性颗粒分散性的研究进展[J].电镀与精饰,2019,(8):29-32.[doi:10.3969/j.issn.1001-3849.2019.08.007]
 PU Shuai*,ZHANG Jin,LI Shuai.Research Progress on the Dispersion of Insoluble Particles of Electroless Plating[J].Plating & Finishing,2019,(8):29-32.[doi:10.3969/j.issn.1001-3849.2019.08.007]
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化学镀不溶性颗粒分散性的研究进展

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备注/Memo

收稿日期: 2019-01-31;修回日期: 2019-04-25
通信作者: 蒲帅,2580040465@qq.com

更新日期/Last Update: 2019-08-10