PDF下载/HTML 分享
[1]李彭瑞*,任春江,章军云,等.电镀参数对电镀镍层性能的影响[J].电镀与精饰,2022,(2):26-29.[doi:10.3969/j.issn.1001-3849.2022.02.006]
 LI Pengrui *,REN Chunjiang,ZHANG Junyun,et al.Effect of Electroplating Parameters on the Performance of Electroplating Nickel Layer[J].Plating & Finishing,2022,(2):26-29.[doi:10.3969/j.issn.1001-3849.2022.02.006]
点击复制

电镀参数对电镀镍层性能的影响

参考文献/References:



[1] Bhatnager M, Baliga B J. Comparison of 6H-SiC, 3C-Si, and Si for power devices[J].IEEE Trans Electron DEV, 1993, 40(3): 645-655.

[2] 刘海琪 , 王泉慧 , 焦刚 , 等 . GaN 功率 MMIC 背面通孔工艺优化及可靠性分析 [J]. 固体电子学研究与进展 , 2011, 31(5): 438-488.

Liu H Q, Wang Q H, Jiao G, et al.Via-hole etch process optimization and reliability analysis for GaN power MMIC [J]. Research & Progress of SSE, 2011, 31(5): 438-488 (in Chinese).

[3] 崔海波 , 梁庭 , 熊继军 , 等 . 碳化硅 ICP 刻蚀速率及表面形貌研究 [J]. 仪表技术与传感器 , 2015, 392(9): 1-7.

Cui H B, Liang T, Xiong J J, et al.Study on etch rate and surface morphology of silicon carbide by ICP [J]. Instrument Technique and Sensor, 2015, 392(9): 1-7 (i n Chinese).

[4] 商庆杰 , 王敬松 , 高渊 , 等 . SiC 基芯片背面通孔刻蚀工艺研究 [J]. 半导体技术 , 2016, 41(7): 527-531.

Shang Q J, Wang J S, Gao Y, et al. Study on the backside via hole etch process of SiC-based chips [J]. Semiconductor Technology, 2016, 41(7): 527-531 (in Chinese).

[5] 孙林 , 谢新根 , 程凯 , 等 . 电镀参数对薄膜电路镀镍层性能的影响 [J]. 电镀与精饰 , 2018, 40(8): 28-33.

Sun L, Xie X G, Cheng K, et al. Effects of electroplating parameter on the performance of nickel-plating layer on thin film circuits [J]. Plating and Finishing, 2018, 40(8): 28-33 (in Chinese).

[6] 吕镖 , 胡振峰 , 汪笑鹤 , 等 . 电流密度对镍镀层结构和性能的影响 [J]. 中国表面工程 , 2013, 26(4): 66-71.

Lv B, Hu Z F, Wang X H, et al. Effect of current density on the microstructrue and properties of plated nickel coating [J]. China Surface Engineering, 2013, 26(4): 66-71 (in Chinese).

[7] 李家明 , 史忠丰 , 蔡成翔 . 平行冲刷给液电沉积镍层的显微硬度研究 [J]. 电镀与环保 , 2014, 34(1): 13-15.

Li J M, Shi Z F, Cai C X. An investigation on microhardness of nickel coating electrodeposited by parallel flushing electrolyte [J]. Electroplating & Pollution Control, 2014, 34(1): 13-15 (in Chinese).

[8] 吕镖 , 汪笑鹤 , 胡振峰 , 等 . 温度对柔性摩擦辅助电沉积镍镀层组织结构的影响 [J]. 稀有金属材料与工程 , 2015, 44(7): 1706-1712.

Lv B, Wang X H, Hu Z F, et al. Effect of temperature on microstructure of flexible friction assisted electrodeposited Ni coating [J]. Rare Metal Materials and Engineering, 2015, 44(7): 1706-1712(in Chinese).

[9] 张海燕 , 曾良宇 . 氨基磺酸盐阳极分解历程探讨 [J]. 材料保护 , 1985, (5): 37-41.

Zhang H Y, Zeng L Y. Mechanism of anodie decomposition in sulfamate solution [J]. Journal of Materials Protection, 1985, (5): 37-41(in Chinese).

[10] 邹章雄 , 项金钟 , 许思勇 .Hall-Petch 关系的理论推导及其适用范围讨论 [J]. 物理测试 , 2012, 30(6): 13.

Zou Z X, Xiang J Z, Xu S Y.Theoretical derivation of Hall-Petch relationship and discussion of its applicable range [J].Physics Examination and Testing, 2012, 30(6): 13 (in Chinese).

[11] Qian J Q, Li H T, Li P R. Effect of technology parameters on microstructure and properties of electroforming nickel layer [J]. Rare Metal Materials and Engineering, 2015, 44(7): 1758-1762.

[12] El-Sherik A M, Erb U, Palumbo G, et al. Deviations from Hall-Petch behavior in as prepared nanocrystalline nickel [J]. Scripta Metallurgica et Materialia, 1992, 27(9): 1185-1188.

相似文献/References:

[1]马 军.电沉积法制备纳米晶Ni-Co合金镀层[J].电镀与精饰,2019,(6):1.[doi:10.3969/j.issn.1001-3849.2019.06.001]
 MA Jun.Preparation of Nanocrystalline Ni-Co Alloy Coatings by Electrodeposition[J].Plating & Finishing,2019,(2):1.[doi:10.3969/j.issn.1001-3849.2019.06.001]
[2]唐 振,谭 俊*,叶 雄,等.糖精钠对Co-Ni合金镀层组织和性能的影响[J].电镀与精饰,2019,(9):7.[doi:10.3969/j.issn.1001-3849.2019.09.002]
 TANG Zhen,TAN Jun*,YE Xiong,et al.Effect of Sodium Saccharin on Microstructure and Properties of Co-Ni Alloy Coating[J].Plating & Finishing,2019,(2):7.[doi:10.3969/j.issn.1001-3849.2019.09.002]
[3]杨航城,田海燕.工艺参数对电镀镍钴合金及其性能的影响[J].电镀与精饰,2021,(4):5.[doi:10.3969/j.issn.1001-3849.2021.04.002]
 YANG Hangcheng,TIAN Haiyan.Effect of Process Parameters on Electrodepositing Ni-Co Alloy and Its Properties[J].Plating & Finishing,2021,(2):5.[doi:10.3969/j.issn.1001-3849.2021.04.002]
[4]李 强,雷 程*,梁 庭,等.碳化硅表面电镀厚镍工艺研究[J].电镀与精饰,2022,(2):51.[doi:10.3969/j.issn.1001-3849.2022.02.011]
 LI Qiang,LEI Cheng *,LIANG Ting,et al.Study on Plating Thick Nickel on Silicon Carbide Surface[J].Plating & Finishing,2022,(2):51.[doi:10.3969/j.issn.1001-3849.2022.02.011]
[5]张立平*,刘庆然,何小兵,等.封孔-成膜工艺对电镀薄镍层耐蚀性能的影响[J].电镀与精饰,2022,(2):56.[doi:10.3969/j.issn.1001-3849.2022.02.012]
 ZHANG Liping*,LIU Qingran,HE Xiaobing,et al.Effect of Hole Sealing-Film Forming Process on Corrosion Resistance of Electroplated Thin Nickel Layer?/html>[J].Plating & Finishing,2022,(2):56.[doi:10.3969/j.issn.1001-3849.2022.02.012]
[6]王 慧,郭秀珍,关海英,等.刀具/齿轮钢表面TiSiCN涂层结构和性能[J].电镀与精饰,2022,(5):1.[doi:10.3969/j.issn.1001-3849.2022.05.001]
 WANG Hui,GUO Xiuzhen,GUAN Haiying,et al.Microstructure and Properties of TiSiCN Coatings on the Surface of Tool/Gear Steel[J].Plating & Finishing,2022,(2):1.[doi:10.3969/j.issn.1001-3849.2022.05.001]
[7]付保英*. 磁控溅射CrSiN涂层及其摩擦磨损性能研究 [J].电镀与精饰,2022,(7):36.[doi:10.3969/j.issn.1001-3849.2022.07.007]
 FU Baoying *.Study on Friction and Wear Properties of CrSiN Coatings Deposited by Magnetron Sputtering[J].Plating & Finishing,2022,(2):36.[doi:10.3969/j.issn.1001-3849.2022.07.007]
[8]石圆圆*,罗玉凤. 轻轨建筑钢结构的表面防护与性能研究 [J].电镀与精饰,2023,(3):60.[doi:10.3969/j.issn.1001-3849.2023.03.009]
 Shi Yuanyuan*,Luo Yufeng.Study on surface protection and properties of light rail building steel structure[J].Plating & Finishing,2023,(2):60.[doi:10.3969/j.issn.1001-3849.2023.03.009]
[9]高吉成,李大玉,靳惠明*. 工程教育专业认证背景下电镀镍教学探索 [J].电镀与精饰,2023,(3):110.[doi:doi: 10.3969/j.issn.1001-3849.2023.03.016]
 Gao Jicheng,Li Dayu,Jin Huiming*.Teaching exploration of the electroplating Ni in the context of engineering education accreditation system[J].Plating & Finishing,2023,(2):110.[doi:doi: 10.3969/j.issn.1001-3849.2023.03.016]
[10]史天静,俞巧珍,王成,等.无氰镀银后处理工艺对镀层表面状态的影响[J].电镀与精饰,2023,(4):13.[doi:10.3969/j.issn.1001-3849.2023.04.003]
 Shi Tianjing,Yu Qiaozhen,Wang Cheng,et al.Effect of the post-treatment in cyanide-free silver plating on the surface condition of the plated layer[J].Plating & Finishing,2023,(2):13.[doi:10.3969/j.issn.1001-3849.2023.04.003]

备注/Memo

收稿日期: 2021-09-07 修回日期: 2021-10-15 作者简介: 李彭瑞( 1988 —),男,硕士,工程师, email : pary_li@163.com

更新日期/Last Update: 2022-01-24