ZHU Yunlong,SUN Fang*,JIANG Hongwei,et al.Preparation and Microstructure of Cu Thin Films by Magnetron Sputtering[J].Plating & Finishing,2022,(3):29-34.[doi:10.3969/j.issn.1001-3849.2022.03.006]
磁控溅射法制备纳米Cu薄膜及其微结构的研究
- Title:
- Preparation and Microstructure of Cu Thin Films by Magnetron Sputtering
- Keywords:
- Cu; thin film; magnetron sputtering; morphology
- 分类号:
- TB742
- 文献标志码:
- A
- 摘要:
- 采用磁控溅射法制备出以 ITO 为基底的纯 Cu 薄膜,考察溅射时间和基底温度等工艺条件对生长 Cu 薄膜的影响。用电子扫描显微镜( SEM )、 X 射线衍射仪( XRD )对薄膜的形貌、厚度和结构进行表征。实验结果表明:在一定范围内调控衬底温度和溅射时间,可获得不同形貌、尺寸和厚度的 Cu 薄膜,所得薄膜的晶体结构为面心立方结构,均沿( 111 )方向择优生长。时间是控制晶粒尺寸的重要因素,溅射时间为 40 min ,所得薄膜粒子较小,结晶度好,且薄膜致密均匀,随着镀膜时间的增加,膜厚与之成线性关系增加,沉积速率为 0.242 μ m/min ;温度对薄膜形貌影响显著, 100 ℃ 时可获得由小粒子堆积成的类柱状结构组成的薄膜, 200 ℃ 时可获得由小粒子堆积成的球形团簇组成的薄膜,随着镀膜温度的增加,膜厚与之不呈线性关系,沉积速率随温度的增加而增大;该方法所制备铜薄膜在催化、传感器等领域有潜在的应用价值。
- Abstract:
- : Cu films based on ITO were prepared by magnetron sputtering. The effect of sputtering time and substrate temperature on the growth of Cu films were studied. The morphology and structure of the produced samples were characterized by scanning electron microscope ( SEM ) and X-ray diffractometer ( XRD ) . It was shown that the size of particles constituting films can be controlled by sputtering time. In order to obtain uniform and compact films with good adhesion to substrate , the optimum time is 40 min. When the deposition time is more than 90 min , the film will peel from the ITO substrate. And , the morphology evolved from pillar-like structure to sphere-like cluster structure with increasing substrate temperature , which indicated that the morphology can be controlled by temperature. Also , such prepared Cu films are expected to be used in catalyst , solar energy cell , sensors and other fields.
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备注/Memo
收稿日期: 2021-01-03 修回日期: 2021-04-17 作者简介: 朱云龙( 2000 —),男,本科,在读学生, E-mail : 2261416703@qq.com * 通信作者: 孙芳( 1978 —),女,博士,教授, E-mail :: fangfanghuaxue@163.com 基金项目: 黑龙江省自然科学基金( LH2019A024 );牡丹江师范学院校级项目( YB2019008 );大学生创新创业项目( 201910233032 )