Zhu Yunlong,Sun Fang*,Jiang Hongwei.Preparation and corrosion resistance performance of magnetron sputtered Cu/ITO films[J].Plating & Finishing,2023,(2):86-93.[doi:10.3969/j.issn.1001-3849.2023.02.014]
磁控溅射法制备Cu/ITO薄膜及其耐蚀性能研究
- Title:
- Preparation and corrosion resistance performance of magnetron sputtered Cu/ITO films
- Keywords:
- magnetron sputtering ; Cu films ; corrosion resistance ; micro-morphology ; clusters
- 分类号:
- TB742
- 文献标志码:
- A
- 摘要:
- 采用磁控溅射技术在 ITO 基底上制备出了 Cu 薄膜，考察了溅射压强和溅射功率对 Cu 薄膜微观结构的影响，采用电子扫描显微镜、 X 射线衍射仪对薄膜的形貌和结构进行了表征，并采用电化学腐蚀实验研究了薄膜的耐蚀性能。结果表明：随着压强从 3 Pa 增加到 8 Pa ，薄膜的晶粒尺寸先增加后减小，结晶度先减弱后增强，压强的增大有利于表面粒子的扩散，使薄膜更加平整，但对表面粗糙度影响不大，压强为 5 Pa 时，晶粒尺寸较大。溅射功率对薄膜的结晶度和晶粒尺寸影响较大，随着功率从 200 W 增加到 400 W ，薄膜的结晶度逐渐增加，功率增加到 400 W 时，晶粒尺寸明显增加，此时薄膜表面粗糙度较大。晶粒尺寸的增加有利于增强薄膜的耐蚀性能，表面粗糙度的增加使薄膜耐蚀性减弱。在压强为 5 Pa ，功率为 200 W 和 400 W 时，所得薄膜耐蚀性较好，铜薄膜的耐蚀性由薄膜的晶粒尺寸、表面粗糙度等因素共同决定，二者对其耐蚀性影响呈现出一种竞争关系。
- Abstract:
- ： Cu films were prepared on ITO substrates by magnetron sputtering technology. The effects of sputtering pressure and power on the microstructure of Cu films were evaluated ， the morphology and structure of the films were characterized by scanning electron microscope and X-ray diffractometer ， and the corrosion resistance of the films was also studied by electrochemical corrosion test. The results show that with the pressure increasing from 3 Pa to 8 Pa ， the grain size of the films increases first and then decreases ， and the crystallinity decreases first and then increases. The increased pressure is beneficial to the diffusion of surface particles ， making the film more flat ， but has little effect on the surface roughness. When the pressure is 5 Pa ， the grain size is larger. The crystallinity and grain size of the films are obviously effected by sputtering power. As the power increases from 200 W to 400 W ， the crystallinity of the films increases gradually. When the power increases to 400 W ， the grain size increases obviously ， and the surface roughness of the films is larger. The increase of grain size is conducive to enhance the corrosion resistance of the films ， and the increase of surface roughness weakens the corrosion resistance of the films. The corrosion resistance of the Cu films is better when the pressure is 5 Pa and the sputtering power is 200 W and 400 W. The corrosion resistance of the Cu films is determined by the grain size and surface roughness ， and the influence of the two factors on the corrosion resistance shows a competitive relationship.
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备注/Memo
收稿日期： 2021-12-12 修回日期： 2022-02-20 作者简介： 朱云龙（ 2000 —），男，在读本科生， email ： 2261416703@qq.com * 通信作者： 孙芳（ 1978 —），女，博士，教授，主要研究方向为功能材料及电化学。 email ： fangfanghuaxue@163.com 基金项目： 牡丹江师范学院校级项目（ YB2019008 ）；黑龙江省自然科学基金（ LH2019A024 ）；黑龙江省教育厅项目（ 1355ZD013 ）；大学生创新创业项目（ 201910233032 ）