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[1]张锦园,张 杰,白忠波,等.硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响[J].电镀与精饰,2024,(5):101-109.[doi:10.3969/j.issn.1001-3849.2024.05.014]
 Zhang Jinyuan,Zhang Jie,Bai Zhongbo,et al.Effect of titanium sulfate and sodium tungstate composite additive on morphology and performance of electrolytic copper foil posttreatment?/html>[J].Plating & Finishing,2024,(5):101-109.[doi:10.3969/j.issn.1001-3849.2024.05.014]
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硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响

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备注/Memo

收稿日期: 2023-09-21 修回日期: 2024-01-05 作者简介: 张锦园( 1999 — ),女,硕士, email : 654781195@qq.com * 通信作者: 刘二勇, email : liueryong@xust.edu.cn

更新日期/Last Update: 2024-05-05