Mao Haina*,Zhang Qinglong,Zhao Yihang,et al.Comparative study on microstructure and electrochemical dissolution properties of microcrystalline and macrocrystalline copper-phosphorus sphere anodes[J].Plating & Finishing,2025,(04):20-25.
doi: 10.3969/j.issn.1001-3849.2025.04.004微晶与粗晶磷铜球阳极组织结构及电化学溶解性能比较研究
- Title:
- Comparative study on microstructure and electrochemical dissolution properties of microcrystalline and macrocrystalline copper-phosphorus sphere anodes
- Keywords:
- microcrystalline copper-phosphorus ball; macrocrystalline copper-phosphorus ball; electroplating anode; printed circuit board; solubility
- 分类号:
- TG172.8
- 文献标志码:
- A
- 摘要:
- 酸性镀铜工艺在印刷电路板制造领域有着广泛的应用。磷铜阳极是酸性镀铜的重要原料,其成分和组织结构对镀铜溶液和镀铜层的质量与性能有着显著的影响。本文选取了两种商用的磷铜球,利用光学显微镜、电子背散射衍射(EBSD)、X射线衍射、波谱仪等对其成分和组织结构进行详细分析,并利用电化学方法研究了两种磷铜球在典型酸性镀铜溶液中的电化学溶解行为。研究表明,微晶磷铜球相比于粗晶磷铜球,晶粒尺寸要小一个数量级,且具有更加均匀细密的磷元素分布状态。在阳极极化和恒电流极化状态下,微晶磷铜球的溶解活性均要更高。而在不受极化影响的自溶解状态下,其溶解趋势和溶解速率均更低,有利于镀液成分的稳定。
- Abstract:
- Acid copper plating process has been widely used in the field of printed circuit board manufacturing. Copper-phosphorus anode is an important raw material for acidic copper plating. Its composition and structure have a significant effect on the quality and performance of copper plating solution and copper plating layer. In this paper, two kinds of commercial copper-phosphorus spheres were selected, and their composition and structure were analyzed in detail by optical microscope, electron backscatter diffraction (EBSD), X-ray diffraction and spectrometer. The electrochemical dissolution behavior of two kinds of phosphorus copper spheres in typical acidic copper plating solution was studied by electrochemical means. The results show that the grain size of microcrystalline phosphorus copper ball is one order of magnitude smaller than that of macrocrystalline copper-phosphorus ball, and it has a more uniform and fine distribution of phosphorus. In the anodic polarization state and the constant current polarization state, the dissolution activity of the microcrystalline phosphorus copper ball is higher. In the self-dissolution state that is not affected by polarization, the dissolution trend and dissolution rate are lower, which is conducive to the stability of the bath composition
参考文献/References:
[1].梅以宁, 魏喆, 魏立安. PCB化学镀铜废液中铜的资源化回收工艺研究[J]. 电镀与涂饰, 2024, 43(2): 149-154.
[2].陈伟光, 刘娟. 添加剂对传感器用PCB环氧树脂板真空蒸镀铜层参数优化及结构的影响[J]. 材料保护, 2022, 55(1): 159-164.
[3].卢赛辉, 吴永德, 侯代云, 等. 超厚铜半埋型PCB制造技术研究[J]. 印制电路信息, 2023, 31(8): 30-32.
[4].王小丽, 何为, 陈先明, 等. PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响[J]. 电化学, 2022, 28(7): 60-69.
[5].杨防祖, 吴伟刚, 田中群, 等. 铜电化学沉积在微孔金属化中的应用[J]. 物理化学学报, 2011, 27(9): 2135-2140.
[6].杨晶, 徐伟玲, 李佳宾. 多层PCB大面积敷铜通孔焊点过锡工艺研究[J]. 航天制造技术, 2012(3): 11-13.
[7].何念, 王健, 潘炎明, 等. PCB酸性镀铜阳极泥与电镀添加剂关系的研究[J]. 印制电路信息, 2023, 31(2): 269-278.
[8].邓文. PCB酸性光亮镀铜添加剂[J]. 电镀与精饰, 1995, 17(4): 39-42.
[9].程良, 周腾芳, 等. 再谈硫酸盐光亮镀铜的磷铜阳极[J]. 电镀与涂饰, 1999(2): 20-26.
[10].李昭. 磷铜阳极微观组织演变及电镀特性研究[D]. 兰州: 兰州理工大学, 2021.
[11].谭发棠, 李劲军, 黎科, 等. 微晶磷铜阳极在不同电流密度下成膜行为的研究[J]. 印制电路信息, 2017, 25(9): 18-19, 70.
[12].陈世荣, 梁志立. PCB磷铜阳极材料的应用及发展趋势[J]. 印制电路信息, 2011(12): 45-49.
[13].王宇辰, 郝宝军, 班向东. 直径微晶磷铜阳极球在PCB电镀方面的应用研究[C]. 2014中日电子电路秋季大会暨秋季国际PCB技术/信息论坛. 2014.
[14].王世卓, 张忠科, 纪宝成, 等. 磷铜球组织对电镀效果影响的研究[J]. 冶金管理, 2022(21): 44-46.
[15].张立伦. 影响酸性电镀铜用磷铜阳极质量因素的探讨[J]. 电镀与涂饰, 2006, 25(9): 35-38.
[16].George F. The science behind materials preparation: A guide to materials preparation and analysis[M]. America: BUEHLER SUM-MET, 2004: 67-77.
[17].Y. Yao, Z. H. Huang, Q. Li, et al. Refining the microstructure, modifying the texture and enhancing the toughness of AZ31B alloy rod by the extrusion and upsetting[J]. Journal of alloys and Compounds, 2018, 764: 202-209.