Guo Zhongzheng*,Yan Wanjun,Zhang Dianxi,et al.Structures and properties of Cu-W composite thin films deposited by Co-sputtering of combination targets[J].Plating & Finishing,2024,(4):38-45.[doi:10.3969/j.issn.1001-3849.2024.04.006]
组合靶共溅射沉积Cu-W复合薄膜的结构与性能
- Title:
- Structures and properties of Cu-W composite thin films deposited by Co-sputtering of combination targets
- Keywords:
- combination targets ; co-sputtering ; Cu-W composite thin films
- 分类号:
- TG146.1
- 文献标志码:
- A
- 摘要:
- 用嵌入组合型靶材，采用磁控共溅射方法，在单晶硅和聚酰亚胺衬底上制备 Cu-W 复合薄膜。分别运用能谱仪、 X 射线衍射仪、扫描电镜和原子力显微镜对 Cu-W 复合薄膜的成份、结构及表面形貌进行分析表征。选用微小力测试系统、纳米压痕仪及四探针仪分别测试复合薄膜的屈服强度 σ 0.2 和裂纹萌生临界应变 ε c 、显微硬度 H 及电阻率 ρ 。结果表明：可通过调整组合型靶材环状溅射刻蚀区内 W 靶所占的面积比，有效地调控复合薄膜的 W 含量。随 W 靶的面积占比从 6% 增至 30% ， Cu-W 复合薄膜的 W 含量从 2.6 at.% 增至 16.9 at.% 。 W 在 Cu 中的固溶度延展，复合膜内存在面心立方（ fcc ） Cu （ W ）亚稳固溶体，随复合膜中 W 含量增加， W 在 Cu 中的固溶度从 1.7 at.%W 增至 10 at.%W ，复合膜的平均晶粒从 32 nm 减小至 16 nm ，表面光洁度提高。 W 含量增加时，复合膜的屈服强度 σ 0.2 、显微硬度 H 及电阻率 ρ 增加，而裂纹萌生临界应变 ε c 减小。
- Abstract:
- ： Cu-W composite thin films were prepared on single-crystal silicon and polyimide substrates by magnetron co-sputtering method with embedded combination targets. The composition ， structure and surface morphology of Cu-W composite thin films were analyzed and characterized using energy dispersive spectrometer ， X-ray diffractometer ， scanning electron microscope and atomic force microscope ， respectively. The yield strength σ 0.2 ， critical strain of crack initiation ε c ， micro hardness H and electrical resistivity ρ of composite thin films were tested using micro force testing system ， nano-indentation instrument and four-point probe ， respectively. The results show that the W content of the composite thin films can be effectively controlled by adjusting the area ratio of the W target in the annular sputtering etching zone of the combination targets. As the proportion of W target area increases from 6% to 30% ， the W content of Cu-W composite thin films increases from 2.6 at.% to 16.9 at.%. The solid solubility of W in Cu extends and with the presence of face centered cubic （ fcc ） Cu （ W ） metastable solid solution in the composite films. As the W content of the composite films increases ， the solid solubility of W in Cu increases from 1.7 at.% W to 10 at.% W. The average grain of the composite films decreases from 32 nm to 16 nm ， and the surface smoothness improves. When the W content increases ， the yield strength σ 0.2 ， microhardness H ， and electrical resistivity ρ of the composite films increase ， while the critical strain of crack initiation ε c decreases.
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备注/Memo
收稿日期： 2023-09-28 修回日期： 2024-03-10 作者简介： 郭中正（ 1983 —），博士，副教授，主要研究方向为金属薄膜材料， email ： 1982gzz@163.com 基金项目： 贵州省教育厅青年科技人才成长项目（黔教合 KY 字［ 2019 ］ 145 号）；贵州省科技计划项目（黔科合支撑［ 2023 ］一般 278 ）资助?/html>