PDF下载 分享
[1]刘建祥*,浦建堂,周 磊,等.有机磺酸盐添加剂对电镀硬铬性能的影响[J].电镀与精饰,2021,(6):6-9.[doi:10.3969/j.issn.1001-3849.2021.06.002]
 LIU Jianxiang*,PU Jiantang,ZHOU Lei,et al.Effect of Organic Sulfonate Additives on Properties of Hard Chromium Electroplating[J].Plating & Finishing,2021,(6):6-9.[doi:10.3969/j.issn.1001-3849.2021.06.002]
点击复制

有机磺酸盐添加剂对电镀硬铬性能的影响

参考文献/References:

[1] 刘俊莲, 陈华三, 江冰. 电镀硬铬技术发展综述及操作要点[J]. 电镀与涂饰, 2013, 32(7): 14-20.
Liu J L, Chen H S, Jiang B. Review on development of hard chromium plating technology and operation key points[J]. Electroplating & Finishing, 2013, 32(7): 14-20 (in Chinese).
[2] Tian H H, Addie G R, Visintainer R J. Erosion-corrosion performance of high-Cr cast iron alloys in flowing liquid-solid slurries[J]. Wear, 2009, 267(11): 2039-2047.
[3] 李昌树. 高效六价铬镀铬工艺研究[D]. 沈阳: 沈阳理工大学, 2008.
[4] 柳岩. 锻钢镀硬铬工艺研究[J]. 电镀与环保, 2012, 32(6): 21-23.
Liu Y. A study of hard chromium electroplating process for forged steel[J]. Electroplating & Pollution Control, 2012, 32(6): 21-23 (in Chinese).
[5] 李新梅. 高效复合镀铬添加剂的研究[D]. 西安: 西安理工大学, 2002.
[6] 张理, 郭震, 蒋晓明, 等. 电镀硬铬工艺原理及铬层组织与性能浅析[J]. 材料保护, 2019, 52(4): 142-147.
Zhang L, Guo Z, Jiang X M, et al. Principle of hard chrome electroplating and analysis on structure and performance of chromium layer[J]. Materials Protection, 2019, 52(4): 142-147 (in Chinese).
[7] 蒲小琴. 添加剂对镀硬铬溶液性能的改善[J]. 涂装与电镀, 2010, (3): 25-27.
Pu X Q. The improvement of additive agent for performances of hard chromium plating solution[J]. Painting & Electroplating, 2010, (3): 25-27 (in Chinese).
[8] 赵黎云, 钟丽萍, 黄逢春. 电镀铬添加剂的发展与展望[J]. 电镀与精饰, 2001, (5): 9-12.
Zhao L Y, Zhong L P, Huang F C. Development and prospect for chromium electroplating additives[J]. Plating & Finishing, 2001, (5): 9-12 (in Chinese).
[9] 常永福. 缸筒内表面镀铬稳定镀液中Cr(Ⅲ)的方法[J]. 电镀与精饰, 2010, 32(6): 35-36.
Chang Y F. Chromium electroplating on cylinder inner wall method for stabilizing Cr(Ⅲ) in the plating bath[J]. Plating & Finishing, 2010, 32(6): 35-36 (in Chinese).
[10] 覃奇贤, 刘淑兰. 电镀液的电流效率及其测定方法[J]. 电镀与精饰, 2008, (4): 27-29.
Qin Q X, Liu S L. Current efficiencies of electroplating bath and measurement method[J]. Plating & Finishing, 2008, (4): 27-29 (in Chinese).
[11] 王力强, 杨由凯, 赵晴, 等. 一种新型微裂纹镀铬工艺及镀层性能研究[J]. 电镀与精饰, 2018, 40(1): 17-21.
Wang L Q, Yang Y K, Zhao Q, et al. Study on a new type of micro-crack chrome plating process and the coating performance[J]. Plating & Finishing, 2018, 40(1): 17-21 (in Chinese).
[12] 王淑振, 朱增伟, 陈斌, 等. 工艺条件对柔性挤压电镀无裂纹硬铬电流效率的影响[J]. 电镀与涂饰, 2016, 35(1):6-9.
Wang S Z, Zhu Z W, Chen B, et al. Effects of process conditions on current efficiency of crack-free hard chrome electroplating with flexible extrusion[J]. Electroplating & Finishing, 2016, 35(1): 6-9 (in Chinese).
[13] 沈品华. 现代电镀手册[M]. 北京: 机械工业出版社, 2010.
[14] 崔楠, 吴扬, 张颖. 环保型硬铬镀层的显微硬度研究[J]. 电镀与环保, 2019, 39(6): 4-6.
Cui N, Wu Y, Zhang Y. Study on microhardness of eco-friendly hard chromium coatings[J]. Electroplating & Pollution Control, 2019, 39(6): 4-6 (in Chinese).
[15] Mekicha M A, De Rooij M B, Matthews D T A, et al. The effect of hard chrome plating on iron fines formation[J]. Tribology International, 2020, 142: 106003.

相似文献/References:

[1]张 帅,邵刚勤,程旭东,等.Ga对Al-Zn-In-Mg-Ga-Sn合金阳极 电化学性能的影响[J].电镀与精饰,2018,(12):1.[doi:10.3969/j.issn.1001?3849.2018.12.001]
 ZHANG Shuai,SHAO Gangqin,CHENG Xudong,et al.Effects of Ga on Electrochemical behavior of Al-Zn-In-Mg-Ga-Sn alloy anode[J].Plating & Finishing,2018,(6):1.[doi:10.3969/j.issn.1001?3849.2018.12.001]
[2]吴双成*,储荣邦.六价铬镀铬添加剂作用原理[J].电镀与精饰,2020,(2):26.[doi:10.3969/j.issn.1001-3849.2020.02.006]
 WU Shuangcheng*,CHU Rongbang.Mechanism of Additives for Hexavalent Chromium Plating[J].Plating & Finishing,2020,(6):26.[doi:10.3969/j.issn.1001-3849.2020.02.006]
[3]石海明,黄章崎,所彭帮,等.阳极电流密度对电镀镍阳极溶解性能的影响[J].电镀与精饰,2020,(3):1.[doi:10.3969/j.issn.1001-3849.2020.03.001]
 SHI Haiming,HUANG Zhangqi,SUO Peng bang,et al.Effect of Anode Current Density on Dissolution Properties of Electroplated Nickel Anode[J].Plating & Finishing,2020,(6):1.[doi:10.3969/j.issn.1001-3849.2020.03.001]
[4]刘颖*,邢希瑞,田栋,等.酸性一价铜电镀铜的工艺及能效分析[J].电镀与精饰,2024,(4):99.[doi:10.3969/j.issn.1001-3849.2024.04.014]
 Liu Ying*,Xing Xirui,Tian Dong,et al.Energy efficiency analysis of copper electroplating employing acidic cuprous solution[J].Plating & Finishing,2024,(6):99.[doi:10.3969/j.issn.1001-3849.2024.04.014]

备注/Memo

收稿日期: 2020-03-30;修回日期: 2020-05-25
作者简介: 刘建祥(1990—),男,山东临沂,硕士研究生,主要从事金属与非金属表面处理研究。email: ljxiang68@163.com
基金项目: 临沂市重点研发计划(2019ZDYF021)

更新日期/Last Update: 2021-06-10