[1]孙海静,杨 帅,王 贺,等.ChCl-Urea低共熔溶剂中电沉积锌的工艺研究[J].电镀与精饰,2021,(11):23-28.[doi:10.3969/j.issn.1001-3849.2021.11.005]
　SUN Haijing,YANG Shuai,WANG He,et al.Study on the Technology of Zinc Electrodeposition in ChCl-Urea Deep Eutectic Solvent[J].Plating & Finishing,2021,(11):23-28.[doi:10.3969/j.issn.1001-3849.2021.11.005]
点击复制

ChCl-Urea低共熔溶剂中电沉积锌的工艺研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2021年11
页码:
23-28
栏目:
出版日期:
2021-11-12

文章信息/Info

Title:
Study on the Technology of Zinc Electrodeposition in ChCl-Urea Deep Eutectic Solvent
作者:
孙海静; 杨 帅; 王 贺; 徐 飞; 杜俊荣; 王媛媛; 毕铭雪; 从铭玥; 孙 杰*
沈阳理工大学环境与化学工程学院，辽宁 沈阳 110159
Author(s):
SUN Haijing;  YANG Shuai;  WANG He;  XU Fei;  DU Junrong;  WANG Yuanyuan;  BI Mingxue;  CONG Mingyue;  SUN Jie*
School of Environmental and Chemical Engineering， Shenyang Ligong University， Shenyang 110159， China
关键词:
低共熔溶剂; 离子液体; 电沉积; 锌; 耐蚀性
Keywords:
deep eutectic solvent ionic liquid electrodeposition zinc corrosion resistance
DOI:
10.3969/j.issn.1001-3849.2021.11.005
文献标志码:
A
摘要:
在摩尔比为1∶2的氯化胆碱-尿素低共熔溶剂（ChCl-Urea DES）中于纯铜基体表面制备了锌镀层。通过调整沉积电位、沉积温度和锌盐配比等参数，采用正交实验优化了电沉积工艺，并通过动电位极化曲线对比研究了ChCl-Urea DES和传统水溶液中锌镀层的耐蚀性能。采用扫描电子显微镜（SEM）和X-射线衍射技术（XRD）对ChCl-Urea DES中锌镀层的微观形貌和物相组成进行了表征。结果表明，在摩尔比为1∶2的ChCl-Urea DES中锌电沉积的最佳方案为沉积电位1.0 V、锌盐配比2ZnCl2∶1ZnO（摩尔比）、沉积温度70 ℃。在此方案下可获得均匀平整，颗粒致密的锌镀层，且其耐蚀性与传统水溶液相当。SEM表明，锌镀层是由排列紧密的六方形立体结构的灰白色颗粒物质构成。XRD表明，锌镀层主要由六方结构的多晶锌组成。
Abstract:
A zinc coating was prepared on a pure copper substrate in a ChCl-Urea deep eutectic solvent （ChCl-Urea DES） with a molar ratio of 1∶2. The electrodeposition process was optimized by orthogonal experiments by adjusting the deposition potential, deposition temperature, and zinc salt ratio. The microscopic morphology and phase composition of the zinc coating in ChCl-Urea DES were characterized by scanning electron microscopy （SEM） and X-ray diffraction （XRD）. The results show that the best solution for zinc electrodeposition in ChCl-Urea DES with a molar ratio of 1∶2 is a deposition potential of 1.0 V, a zinc salt ratio of 2ZnCl2∶1ZnO （molar ratio）, and a deposition temperature of 70 °C. The results show that a homogeneous and flattened surface can be obtained with this solution. SEM shows that the zinc coating is composed of grayish-white granular material with a tightly arranged hexagonal three-dimensional structure, while XRD shows that the zinc coating is mainly composed of polycrystalline zinc with a hexagonal structure.

参考文献/References:

[1] 屠振密, 潘莉, 翟淑芳等. 电沉积锌合金镀层的特性及应用[J]. 电镀与精饰, 2004,3: 15-19.
Tu Z M, Pan L, Qu S F, et al. The characteristics and applications of electrodeposited zinc alloys coatings[J]. Plating and Finishing, 2004, 3: 15-19(in Chinese).
[2] 屠振密. 电沉积锌与锌基合金的现状与发展[J]. 电镀与精饰, 1994, 3: 3-3
Tu Z M. Status and development of electrodeposited zinc and zinc-based alloys[J]. Plating and Finishing, 1994, 3: 3-3(in Chinese).
[3] 安茂忠. 电镀锌及锌合金发展现状[J]. 电镀与涂饰, 2003, 6:35-40.
An M Z. Current development of zinc and zinc alloy electroplating[J]. Electroplating & Finishing, 2003, 6:35-40(in Chinese).
[4] 张启富, 刘邦津, 仲海峰. 热镀锌技术的最新进展[J]. 钢铁研究学报, 2002, 4:65-72.
Zhang Q F, Liu B J, Zhong H F. Development trend of hot-dip galvanizing technology[J]. Journal of Iron and Steel Research, 2002, 4: 65-72(in Chinese).
[5] 焦莎, 刘燕, 万冰华, 等. 碱性无氰镀锌液组成和阴极电流密度对电流效率与锌层外观的影响[J]. 电镀与涂饰, 2015, 34(24): 1395-1399.
Jiao S, Liu Y, Wan B H, et al. Effect of bath composition and cathodic current density on current efficiency of cyanide-free alkali[J]. Electroplating & Finishing, 2015, 34(24):1395-1399(in Chinese).
[6] Abbott A P, Eardley C A, Fardley N R, et al. Novel room temperature molten salts for aluminum electrodeposition[J]. Transactions of the Institute of Metal Finishing, 1999, 77(1):26-28.
[7] Brett C M A. Deep eutectic solvents and applications in electrochemical sensing[J]. Current Opinion in Electrochemistry, 2018, 10:143-148.
[8] Tomel L I N, Baiao V, Silva W, et al. Deep eutectic solvents for the production and application of new materials[J]. Applied Materials Today, 2018, 10:30-50.
[9] Abohamad A, Hayyan M, Alsaadi M A H, et al. Potential applications of deep eutectic solvents in nanotechnology[J]. Chemical Engineering Journal, 2015, 273:551-567.
[10] Abbott A P, Capper G, Mckenzie K J, et al. Electrodeposition of zinc-tin alloys from deep eutectic solvents based on choline chloride[J]. Journal of Electroanalytical Chemistry, 2007, 599(2):288-294.
[11] 王巍, 初青伟, 梁军等. 氯化胆碱-尿素离子液体中镁合金表面电沉积电流密度对镀锌层性能的影响[J]. 材料保护, 2013, 46, 8:1-5.
Wang W, Chu Q W, Liang J, et al. Influence of current density on corrosion resistance of electroplated zinc coating of magnesium alloy[J]. Materials Protection, 2013, 46, 8:1-5(in Chinese).
[12] Pereira N M, Pereira C M, Araujo J P, et al. Zinc electrodeposition from deep eutectic solvent containing organic additives[J]. Journal of Electroanalytical Chemistry, 2017, 801: 545-551.
[13] Song Y, Tang J, Hu J, et al. Interfacial assistant role of amine additives on zinc electrodeposition from deep eutectic solvents: an in situ X-ray imaging investigation[J]. Electrochimica Acta, 2017, 240: 90-97.

相似文献/References:

[1]周 超,李 勇,薛向欣.利用吡啶类离子液体萃取分离电镀污泥中的Cr6+与Fe3+[J].电镀与精饰,2019,(1):41.[doi:10.3969/j.issn.1001-3849.2019.01.009]
　ZHOU Chao,LI Yong,XUE Xiangxin.Extraction Separation of Cr6+ and Fe3+ from Electroplating Sludge Using Pyridine Ionic Liquids[J].Plating & Finishing,2019,(11):41.[doi:10.3969/j.issn.1001-3849.2019.01.009]
[2]卜路霞,李京京,高琳琳,等.SDBS对多壁碳纳米管悬浮液分散性的影响[J].电镀与精饰,2019,(7):10.[doi:10.3969/j.issn.1001-3849.2019.07.003]
　BU Luxia,LI Jingjing,GAO Linlin,et al.Dispersion of Multi-Walled Carbon Nanotubes in Solution with Surfactant SDBS[J].Plating & Finishing,2019,(11):10.[doi:10.3969/j.issn.1001-3849.2019.07.003]
[3]向倩,王文昌*,张然,等.镍离子浓度对低共熔溶剂中化学镀Ni-Mo-P合金镀层的影响[J].电镀与精饰,2022,(12):17.[doi:10.3969/j.issn.1001-3849.2022.12.003]
　XIANG Qian,WANG Wenchang*,ZHANG Ran,et al.Effect of Nickel Ion Concentration on Electroless Plating of Ni-Mo-P Alloy in Deep Eutectic Solvent[J].Plating & Finishing,2022,(11):17.[doi:10.3969/j.issn.1001-3849.2022.12.003]
[4]王 昊,曹晓舟*,薛向欣.低共熔溶剂中电沉积锡及锡合金镀层的研究进展[J].电镀与精饰,2023,(1):56.[doi:10.3969/j.issn.1001-3849.2023.01.009]
　Wang Hao,Cao Xiaozhou*,Xue Xiangxin.Research progress on electrodeposition of tin and tin alloys coatings in eutectic solvents[J].Plating & Finishing,2023,(11):56.[doi:10.3969/j.issn.1001-3849.2023.01.009]
[5]宋启良*,李吉丹,郑玉杰,等.航天用T9A-D弹簧表面离子液体镀Al工艺研究[J].电镀与精饰,2024,(2):10.[doi:10.3969/j.issn.1001-3849.2024.02.002]
　Song Qiliang*,Li Jidan,Zheng Yujie,et al.Study on ionic liquid Al plating technology on surface of T9A-D spring for aerospace applications[J].Plating & Finishing,2024,(11):10.[doi:10.3969/j.issn.1001-3849.2024.02.002]
[6]徐铭孝,战充波,张司琪,等. 丁二酰亚胺对低共熔溶剂中银成核机理的影响 [J].电镀与精饰,2024,(3):34.[doi:10.3969/j.issn.1001-3849.2024.03.005]
　Xu Mingxiao,Zhan Chongbo,Zhang Siqi,et al.Effect of succinimide on the nucleation mechanism of silver in deep eutectic solvents[J].Plating & Finishing,2024,(11):34.[doi:10.3969/j.issn.1001-3849.2024.03.005]
[7]邹庆田.乙二醇在电沉积中的应用[J].电镀与精饰,2024,(4):74.[doi:10.3969/j.issn.1001-3849.2024.04.011]
　Zou Qingtian.The application of ethylene glycol in electrodeposition[J].Plating & Finishing,2024,(11):74.[doi:10.3969/j.issn.1001-3849.2024.04.011]
[8]储小鹏,李艳香,刘建新,等.doi: 10.3969/j.issn.1001-3849.2025.07.0014离子液体体系中电镀技术研究进展[J].电镀与精饰,2025,(07):89.
　Lai Xinqiao,Luo Youbin,Li Wangliang*.Research progress of electroplating technology in ionic liquid system Chu Xiaopeng1,2Li Yanxiang1,3, Liu Jianxin2, Liu Ninghua4,[J].Plating & Finishing,2025,(11):89.
[9]朱理科,郝建军,刘 洋,等.doi: 10.3969/j.issn.1001-3849.2026.06.003低共熔溶剂中SiC颗粒对Ni电沉积行为的影响[J].电镀与精饰,2026,(06):25.
　ZHU Like,HAO Jianjun,LIU Yang,et al.Influence of SiC particles on nickel electrodeposition behavior in deep eutectic solvents[J].Plating & Finishing,2026,(11):25.

备注/Memo

备注/Memo:
收稿日期： 2020-12-09；修回日期： 2021-01-20
作者简介： 孙海静（1985-），女，博士，副教授，hjsun@sylu.edu.cn
*通信作者： 孙杰，jiersun2000@126.com
基金项目： 辽宁省教育厅青年科技人才“育苗”项目（LG201928）；辽宁省沈阳材料科学国家研究中心联合研发
更新日期/Last Update: 2021-11-10