PDF下载 分享
[1]刘 燕*,李文生,修文波,等.基于有限元仿真方法的镀银层厚度均匀性研究[J].电镀与精饰,2021,(11):36-41.[doi:10.3969/j.issn.1001-3849.2021.11.007]
 LIU Yan*,LI Wensheng,XIU Wenbo,et al.Research on Thickness Uniformity of Silver Coating Based on Finite Element Simulation[J].Plating & Finishing,2021,(11):36-41.[doi:10.3969/j.issn.1001-3849.2021.11.007]
点击复制

基于有限元仿真方法的镀银层厚度均匀性研究

参考文献/References:

[1] 隋明丽, 张辉. 发动机高温合金紧固件高温粘结研究[J]. 航空标准化与质量, 2012, 3:14-16.
Sui M L, Zhang H. Study on high temperature bonding of engine superalloy fastener[J]. Aeronautic Standardization & Quality, 2012, 3:14-16(in Chinese).
[2] 邱星瀚, 陈亚军, 杨雅婷, 等. V2500发动机燃烧室紧固件银镀层失效机理研究[J]. 电镀与精饰, 2021, 43(7):1-9.
Qiu X H, Chen Y J, Yang Y T. Failure mechanism of silver coatings on fasteners developed for V2500 aero-engine combustor[J]. Plating & Finishing, 2021, 43(7):1-9(in Chinese).
[3] Mohammed S D, Desai H. Basic concepts of finite element analysis and its applications in dentistry: an overview[J]. Journal of Oral Hygiene & Health, 2014, 2(156):2332-0702.
[4] Geng J P, Tan K B, Liu G R. Application of finite element analysis in implant dentistry: a review of the literature[J]. Journal of Prosthetic Dentistry, 2001, 85: 585-598.
[5] Alan R, North A B, Elsyca N V, et al. Design for electroplating: OEM automotive parts industry stands to benefit from computer-aided plating simulation[J]. Metal Finishing, 2009, 107(4):47-50.
[6] 武佳, 曹伟产, 徐曦, 等. 高压气体断路器压气缸电镀银仿真研究[J]. 电镀与涂饰, 2021, 40(7):516-524.
Wu J, Cao E C, Xu X, et al. Simulation study of silver electroplating on pressure cylinder of high-voltage circuit breaker[J]. Electroplating & Finishing, 2021, 40(7):516-524. (in Chinese).
[7] 程海雨, 王 超, 董恩吉, 等. 基于有限元仿真的实验用铜电解槽结构改进策略分析[J]. 河北水利电力学院学报, 2021,31(3):1-6.
Cheng H Y, Wang C, Dong E J, et al. Improved strategy for copper electrolytic cell structure based on finite element simulation analysis[J]. Journal of Hebei University of Water Resources and Electric Engineering, 2021,31(3):1-6(in Chinese).
[8] Chul P, Kyoung Y P. An effect of dummy cathode on thickness uniformity in electroforming process[J]. Results in Physics, 2014, 4:107-112.
[9] Lindsay J H. Shop talk: design, care & construction of plating racks[J]. Plating and Surface Finishing, 2000, 87(10):25-32.
[10] Kim N S, Oh H D, Kang T. Optimization of current distributions of electroplating on patterned substrates with the auxiliary electrode[J]. Journal of The Korean Institute of Surface Engineering, 1995, 25(3):164-173.

备注/Memo

收稿日期: 2020-08-20;修回日期: 2020-09-22
*通信作者: 刘燕,Email:aliya0719@163.com
基金项目: 国防科工局技术基础项目(JSZL2019204B007)、中国航天科工集团公司工艺振兴项目(GYZX2021A043)

更新日期/Last Update: 2021-11-10