Sun Peng,Shen Xixun,*,et al.Research progress in hole metallization technology for printed circuit boards[J].Plating & Finishing,2023,(12):89-94.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.013]
印制线路板的孔金属化技术的研究进展
- Title:
- Research progress in hole metallization technology for printed circuit boards
- Keywords:
- printed circuit board ; hole metallization ; direct plating ; conductive polymers ; black hole process
- 分类号:
- TN41
- 文献标志码:
- A
- 摘要:
- 当前印制线路板的孔金属化主要通过化学镀铜工艺来实现。但其成分体系复杂，工艺操作繁琐，活化处理所需的贵金属成本高昂，而且其使用的还原剂甲醛具有致癌性。显然，这些不足已经无法满足印制线路板升级发展对表面处理的高要求。为此，本文分析了近些年环保型化学镀铜、钯胶体工艺、黑孔化工艺以及导电聚合物工艺等新型的金属化工艺的研究现状及存在的问题，并阐述了导电聚合物工艺的优越性和实用性。
- Abstract:
- ： At present ， the hole metallization of printed circuit boards is achieved through electroless copper plating process. However ， this treatment process has a complex composition system and a cumbersome process and uses precious metals for activation and carcinogenic formaldehyde as a reducing agent. Obviously ， these shortcomings are no longer to meet the high requirements for surface treatment in the upgrading and development of printed circuit boards. To this end ， this article analyzes the research status and existing problems of new metallization processes such as environmentally friendly chemical copper plating ， palladium colloid process ， black hole process ， and conductive polymer process in recent years ， and elaborates on the advantages and practicality of conductive polymer process.
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备注/Memo
收稿日期： 2023-04-03 修回日期： 2023-06-01 作者简介： 孙鹏（ 1998 —），男，硕士在读， email ： 2691522644@qq.com * 通信作者： 沈喜训（ 1977 —），男，博士，副教授， email ： shenxixun@shiep.edu.cn 基金项目： 国家自然科学基金面上项目（ 21972090 ），上海市科委项目（ 19DZ2271100 ），中国科学院学部咨询评议项目（ 2020-HX02-B-030 ）