[1]孙 鹏,沈喜训 *,马 祥,等.印制线路板的孔金属化技术的研究进展[J].电镀与精饰,2023,(12):89-94.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.013]
　Sun Peng,Shen Xixun,*,et al.Research progress in hole metallization technology for printed circuit boards[J].Plating & Finishing,2023,(12):89-94.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.013]
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印制线路板的孔金属化技术的研究进展
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《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2023年12
页码:
89-94
栏目:
出版日期:
2023-12-15

文章信息/Info

Title:
Research progress in hole metallization technology for printed circuit boards
作者:
（1.上海电力大学 环境与化学工程学院，上海 200090； 2.上海市电力材料防护与新材料重点实验室，上海 200090； 3.上海热交换系统节能工程技术研究中心，上海 200090； 4.上海航天信息基础研究所，上海 201109）
Author(s):
( 1.School of Environmental and Chemical Engineering Shanghai University of Electric Power Shanghai 200090 China 2.Shanghai Key Laboratory of Materials Protection and Advanced Materials in Electric Power Shanghai 200090 China 3. Shanghai Engineering Research Center of Energy-Saving in Heat Exchange Systems Shanghai 200090 China 4.Shanghai Academy of Spaceflight Technology Shanghai 201109 China )
关键词:
印制电路板; 孔金属化; 直接电镀; 导电聚合物; 黑孔化工艺
Keywords:
printed circuit board ;  hole metallization ;  direct plating ;  conductive polymers ;  black hole process
分类号:
TN41
DOI:
doi ： 10.3969/j.issn.1001-3849.2023.12.013
文献标志码:
A
摘要:
当前印制线路板的孔金属化主要通过化学镀铜工艺来实现。但其成分体系复杂，工艺操作繁琐，活化处理所需的贵金属成本高昂，而且其使用的还原剂甲醛具有致癌性。显然，这些不足已经无法满足印制线路板升级发展对表面处理的高要求。为此，本文分析了近些年环保型化学镀铜、钯胶体工艺、黑孔化工艺以及导电聚合物工艺等新型的金属化工艺的研究现状及存在的问题，并阐述了导电聚合物工艺的优越性和实用性。
Abstract:
： At present ， the hole metallization of printed circuit boards is achieved through electroless copper plating process. However ， this treatment process has a complex composition system and a cumbersome process and uses precious metals for activation and carcinogenic formaldehyde as a reducing agent. Obviously ， these shortcomings are no longer to meet the high requirements for surface treatment in the upgrading and development of printed circuit boards. To this end ， this article analyzes the research status and existing problems of new metallization processes such as environmentally friendly chemical copper plating ， palladium colloid process ， black hole process ， and conductive polymer process in recent years ， and elaborates on the advantages and practicality of conductive polymer process.

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备注/Memo

备注/Memo:
收稿日期： 2023-04-03 修回日期： 2023-06-01 作者简介： 孙鹏（ 1998 —），男，硕士在读， email ： 2691522644@qq.com * 通信作者： 沈喜训（ 1977 —），男，博士，副教授， email ： shenxixun@shiep.edu.cn 基金项目： 国家自然科学基金面上项目（ 21972090 ），上海市科委项目（ 19DZ2271100 ），中国科学院学部咨询评议项目（ 2020-HX02-B-030 ）
更新日期/Last Update: 2023-12-13