Zhang Deliang,Zhu Lin*,Zheng Haoshuai,et al.Research on the bondability of roughen pre-electroplated lead frame[J].Plating & Finishing,2024,(12):107-113.
粗化预电镀引线框架的可键合性研究
- Title:
- Research on the bondability of roughen pre-electroplated lead frame
- Keywords:
- electroplating rough nickel; electrochemical deposition solution; lead frames; statistical testing methods
- 分类号:
- TN405
- 文献标志码:
- A
- 摘要:
- 本文采用技术验证与统计学检验方法，使用自主研发的一款电镀粗镍用电化学沉积液，制备了粗化预电镀引线框架产品，并对产品可键合性能的影响因素进行了研究。研究结果表明，通过优化粗镍用电化学沉积液中的分散剂含量以及金层、钯层、镍层的厚度，可显著提升粗化预电镀引线框架的可键合性，制备出的粗化预电镀引线框架产品的键合性能完全满足行业内的应用要求，有望实现该类产品的国产化替代。
- Abstract:
- Using technical validation and statistical testing methods, a self-developed electrochemical deposition solution for electroplating rough nickel was used to prepare a roughened pre-electroplated lead frame product, and the influencing factors of the product’s bonding performance were studied. The research results indicate that by optimizing the dispersant content in the electrochemical deposition solution for rough nickel and the thickness of the gold layer, palladium layer and nickel layer, the bondability of the roughened pre-electroplated lead frames can be significantly improved. The bonding performance of the prepared roughened pre-electroplated lead frame products fully meets the application requirements in the industry, and it is expected to achieve domestic substitution of such products
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相似文献/References:
[1]张德良,朱 林*,郑浩帅,等.doi: 10.3969/j.issn.1001-3849.2025.03.010粗化预电镀引线框架的可靠性研究[J].电镀与精饰,2025,(03):67.
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