Zhao XiaoxiaChen LiqiangTian Hongbo.Research on chemical tin precipitation process in heterojunction solar cells[J].Plating & Finishing,2025,(01):9-14.
doi: 10.3969/j.issn.1001-3849.2025.01.002硅异质结太阳能电池中化学镀锡工艺的研究
- Title:
- Research on chemical tin precipitation process in heterojunction solar cells
- Keywords:
- electroless tin plating; copper grid; mechanical properties; micro structure; deposition time
- 分类号:
- TM914.4
- 文献标志码:
- A
- 摘要:
- 以电镀有铜栅线的高效硅异质结太阳能电池结构为基底，采用化学镀锡的方法在铜栅线表面沉积金属锡层，研究了去铜时间以及化锡时间等化学镀锡工艺参数对铜栅线表面形貌及其内部结构的影响。结果表明：随着微刻蚀时间的加长，铜栅线表面形貌平整程度呈增强趋势，当时间达到240 s时会产生过刻蚀现象。当化锡时间从1 min增加至12 min时，锡镀层的微观形貌发生变化，随着沉积时间的增加化学侧蚀程度加重，当化锡时间超过6 min时，锡层与铜栅线的结合力显著下降。
- Abstract:
- Using an efficient silicon heterojunction solar cell structure electroplated with copper grid wires as the substrate, a metal tin layer was deposited on the surface of copper grid lines using electroless tin plating method. The effect of the electroless tin plating process parameters such as copper removal time and tin plating time on the surface morphology and internal structure of the copper grid wires was investigated. The results show that with the increasing of micro-etching time, the surface morphology of the copper grid becomes smoother, and over-etching phenomenon occurs when the time reaches 240 s. When the tin plating time increase from 1 minute to 12 min, the morphology of the tin coatings changes. As the deposition time increases, the degree of lateral etching becomes more serious. When the tin plating time exceeds 6 minutes, the bonding force between the tin layer and the copper grid wire significantly decreases.
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