Hu Xiaoqiang,Fang Zheng*.Simulation study of tetranitro-tetrazolium blue inhibitor in copper electroplating for printed circuit boards vias Yang Guangzhu1, XieJun1, Chen Dedeng1, Lei Yi1, Wei Xiangfu1,2,[J].Plating & Finishing,2025,(03):39-46.
doi: 10.3969/j.issn.1001-3849.2025.03.006电路板通孔电镀铜四硝基四氮唑蓝抑制剂的模拟研究
- Title:
- Simulation study of tetranitro-tetrazolium blue inhibitor in copper electroplating for printed circuit boards vias Yang Guangzhu1, XieJun1, Chen Dedeng1, Lei Yi1, Wei Xiangfu1,2,
- 分类号:
- TQ153.14
- 文献标志码:
- A
- 摘要:
- 采用模拟与实验方法研究了四硝基四氮唑蓝(TNBT)抑制剂对柔性电路板浅通孔电镀铜的均镀能力(TP)的影响。首先采用分子动力学(MD)模拟研究了TNBT抑制剂在Cu(111)表面的吸附行为，进一步使用密度泛函理论(DFT)计算揭示了TNBT抑制剂的吸附机制，最后通过电镀实验探明了TNBT抑制剂对通孔电镀TP值的影响规律。结果表明：TNBT分子主要通过苯甲醚和硝基苯等活性位点与Cu(111)表面发生化学吸附作用；TNBT分子的吸附行为主要由其前沿分子轨道分布的官能团所主导；TNBT分子展现较强的铜沉积抑制作用，并显著提高浅通孔电镀的TP值。该抑制剂有效克服了传统添加剂过度依赖对流环境的缺点，能满足浅通孔的超高TP值电镀要求。
- Abstract:
- This study employs both simulation and experimental methods to investigate the impact of the tetranitrotetrazole blue (TNBT) inhibitor on the throwing power (TP) of copper electroplating in shallow through-holes of flexible printed circuit boards. Initially, molecular dynamics (MD) simulations were utilized to examine the adsorption behavior of TNBT inhibitors on the Cu(111) surface. Subsequently, density functional theory (DFT) calculations were conducted to elucidate the adsorption mechanism of TNBT inhibitors. Finally, electroplating experiments were performed to determine the influence of TNBT inhibitors on the TP values in through-hole electroplating. The results indicate that TNBT molecules primarily undergo chemical sorption on the Cu(111) surface through active sites such as benzyl ether and nitrobenzene groups. The adsorption behavior of TNBT molecules is primarily governed by the functional groups distributed in their frontier molecular orbitals.The TNBT molecules exhibit a strong inhibition effect on copper deposition, and significantly enhancing the TP value in shallow through-hole electroplating. This inhibitor successfully addresses the limitations of traditional additives that heavily depend on the convective environment, thereby meeting the ultra-high TP value requirements for shallow through-hole electroplating
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