[1]周进群,陈柳明*,蒋忠明,等.doi: 10.3969/j.issn.1001-3849.2025.03.007印制电路板盲孔镀铜层热应力的仿真研究[J].电镀与精饰,2025,(03):47-52.
Zhou Jinqun,Chen Liuming*,Jiang Zhongming,et al.Simulation research on thermal stress of blind vias filled by copper plating in printed circuit boards[J].Plating & Finishing,2025,(03):47-52.
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Zhou Jinqun,Chen Liuming*,Jiang Zhongming,et al.Simulation research on thermal stress of blind vias filled by copper plating in printed circuit boards[J].Plating & Finishing,2025,(03):47-52.
doi: 10.3969/j.issn.1001-3849.2025.03.007印制电路板盲孔镀铜层热应力的仿真研究
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
卷:
期数:
2025年03
页码:
47-52
栏目:
出版日期:
2025-03-31
- Title:
- Simulation research on thermal stress of blind vias filled by copper plating in printed circuit boards
- 分类号:
- TQ153.4
- 文献标志码:
- A
- 摘要:
- 随着电子设备精巧化的提升，采用电镀铜填充盲孔的高密度互连(High Density Interconnector，HDI)印制电路板得到广泛应用，但与此同时盲孔带来的可靠性问题也日益凸显。针对电镀铜填充的三阶盲孔叠孔结构，采用仿真手段，探究了板材热膨胀系数、叠孔结构、焊盘宽度、板材厚度对盲孔镀铜层热应力分布的影响规律。结果表明盲孔与焊盘连接的拐角处存在着明显的应力集中现象，板材热膨胀系数和叠构对孔铜热应力分布影响显著，焊盘宽度影响不大，板材厚度的增加会导致铜的热应力分布增大。
- Abstract:
- With the improvement of the sophistication of electronic equipment, high density interconnector, (HDI) printed circuit boards with copper electroplated blind vias have been widely used, and the reliability failure caused by microvia is increasingly prominent. In this paper, the simulation is employed to investigate the thermal stress of three step blind via structure. The influence of different plate thermal expansion coefficients, stacked hole structures, pad widths, and plate thicknesses on the thermal stress distribution of hole copper. The results show that there is an obvious stress concentration phenomenon at the corner where the blind via and the pad connect. The thermal expansion coefficient and stacking structure of the board have a significant impact on the thermal stress distribution of the copper. The pad width has little effect. The increase of the board thickness increases the thermal stress of the copper. The distribution is increased
更新日期/Last Update:
2025-03-18