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[1]方正,韦相福,杨广柱,等.doi: 10.3969/j.issn.1001-3849.2025.03.015盲孔数值仿真电镀铜研究进展[J].电镀与精饰,2025,(03):106-115.
　Hu Xiaoqiang,Chen Dedeng.Advances in numerical simulation of copper electroplating in blind vias Fang Zheng1, Wei Xiangfu1,2, Yang Guangzhu1, Mao Xianchang1,3, Wei Song3*,[J].Plating & Finishing,2025,(03):106-115.

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doi: 10.3969/j.issn.1001-3849.2025.03.015盲孔数值仿真电镀铜研究进展

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2025年03 页码: 106-115 栏目: 出版日期: 2025-03-31

Title:: Advances in numerical simulation of copper electroplating in blind vias Fang Zheng1, Wei Xiangfu1,2, Yang Guangzhu1, Mao Xianchang1,3, Wei Song3*,

作者:: 方正¹; 韦相福¹; 2; 杨广柱¹; 毛献昌¹; 3; 位松^3*; 胡小强⁴; 陈德灯¹; (1. 广西交通职业技术学院汽车工程学院,广西南宁 530023 ;2. 广西大学机械工程学院,广西南宁 530004 ;3. 桂林电子科技大学机电工程学院,广西桂林541004;4. 华为技术有限公司中央研究院,广东深圳 5 18129)

Author(s):: Hu Xiaoqiang4; Chen Dedeng1; (1. College of Automotive Engineering, Guangxi Transport Vocational and Technical College, Nanning 530023,China; 2. School of Mechanical Engineering, Guangxi University, Nanning 530004, China; 3. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; 4. Huawei Technologies Company Limited Central Research Institute, Shenzhen 518129, China.)

关键词:: 盲孔填充; 电镀铜; 添加剂; 数值仿真

Keywords:: blind vias filling; copper electroplating; additive; numerical simulation

分类号:: TQ153.14

文献标志码:: A

摘要:: 随着电子器件的高度集成化发展，微电子互连结构作为电气导通的关键组成部分，面临着诸多挑战，尤其在电镀铜金属化方面。其中，实现盲孔无缺陷填充的电镀铜技术的研发成为行业亟需解决的重要问题。先进电镀铜技术的开发需要综合考虑添加剂、镀液对流等关键因素的强耦合作用，而数值仿真技术在应对此类问题时具有显著优势。笔者从数值仿真的视角出发，系统梳理了盲孔电镀铜的研究进展，深入分析了添加剂的作用机理，探讨了盲孔的超级填充电镀机制，并讨论了添加剂浓度、电流参数和对流条件等关键因素对盲孔电镀铜效果的具体影响，旨在为电子电镀铜技术的高效研发提供参考。

Abstract:: With the highly integrated development of electronic devices, the microelectronic interconnect structure, as a crucial component for electrical conduction, faces numerous challenges, particularly in the metallization of copper electroplating. Among them, the development of defect-free filling technology for blind vias in copper electroplating has become an urgent and significant issue in the industry. The development of advanced copper electroplating technology requires comprehensive consideration of key factors such as additives, electrolyte flow, and their strong coupling effects. Numerical simulation technology exhibits significant advantages in addressing such issues. This paper adopts a numerical simulation perspective to systematically review advancements in blind vias copper electroplating research. It deeply analyzes the mechanism of additives, explores the superfilling electroplating mechanism in blind vias, and discusses the specific effects of key factors such as additive concentration, current parameters, and convective conditions on the effectiveness of blind via copper electroplating. The aim is to provide valuable insights for the efficient development of electronic copper electroplating technology

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更新日期/Last Update: 2025-03-18