Gao Xiaoying,Wang Haojun*,Zhou Yanwen,et al.Research on process parameters and properties of non-cyanide copper plating in HEDP system[J].Plating & Finishing,2025,(04):42-49.
doi: 10.3969/j.issn.1001-3849.2025.04.007HEDP体系无氰镀铜的工艺参数和性能研究
- Title:
- Research on process parameters and properties of non-cyanide copper plating in HEDP system
- Keywords:
- electroplated copper; hydroxyethylphosphonic acid; orthogonal experiment; fatigue performance; hydrogen embrittlement performance
- 分类号:
- TQ153.2
- 文献标志码:
- A
- 摘要:
- 采用羟基乙叉二膦酸体系的无氰镀铜槽液在30CrMnSiA基体上沉积镀铜层，研究了电流密度、槽液温度和铜离子浓度对沉积速率、分散能力和镀层结合力的影响；同时研究了电流密度对电流效率的影响，温度对光亮区电流密度的影响；同时研究了无氰镀铜和氰化镀铜在氢脆性能和疲劳性能上的差异。结果表明：镀层沉积速率和电流密度、电镀温度和铜离子浓度呈正相关。在正交试验参数范围内，电流密度对沉积速率的影响最大，其次是温度，最后是铜离子浓度；在正交试验的参数范围内，电流密度对镀液分散性的影响最大，其次是温度，最后是铜离子浓度；HEDP电镀铜的电流效率在电流密度2 A/dm2时达到了最大值；随着镀液温度升高，光亮区域范围的电流密度逐渐增大，温度为65 ℃时，半光亮区域的电流密度上限可达4.5 A/dm2；无氰镀铜和氰化镀铜对基材的氢脆性能和疲劳性能的影响几乎一致，在可接受范围内。
- Abstract:
- A cyanide-free copper plating bath was used to deposit a copper plating layer on a 30CrMnSiA substrate using a hydroxyethylidene phosphonic acid system. The effects of current density, bath temperature, and copper ion concentration on deposition rate, dispersion ability, and coating adhesion were studied; At the same time, the influence of current density on current efficiency and the influence of temperature on current density in the bright region were studied; At the same time, the differences in hydrogen embrittlement and fatigue performance between cyanide free copper plating and cyanide copper plating were studied. The results indicate that the deposition rate of the coating is positively correlated with current density, electroplating temperature, and copper ion concentration. Within the range of orthogonal experimental parameters, the current density has the greatest impact on deposition rate, which is actually temperature, followed by copper ion concentration; Within the parameter range of orthogonal experiment, current density has the greatest impact on the dispersion of plating solution, followed by temperature, and finally copper ion concentration; The current efficiency of HEDP copper electroplating reaches its maximum value at a current density of 2 A/dm2; As the temperature of the plating solution increases, the current density in the bright area gradually increases. At a temperature of 65 ℃, the upper limit of the current density in the semi bright area can reach 4.5 A/dm2; The effects of cyanide free copper plating and cyanide copper plating on the hydrogen embrittlement and fatigue properties of the substrate are almost identical and within an acceptable range
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