无氰镀铜资讯
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
卷:
期数:
2013年11
页码:
9-14+46
栏目:
出版日期:
2019-06-08
- Title:
- Information for Non-cyanide Copper Plating
- 分类号:
- TQ153.14
- 摘要:
- 介绍了无氰镀铜工艺,包括预镀镍、酸性预镀铜、浸铜、焦磷酸盐镀铜、HEDP和有机膦酸多元络合镀铜、乙二胺镀铜、EDTA镀铜、一价铜镀铜和柠檬酸盐-酒石酸盐镀铜等工艺,介绍了各种预镀铜工艺的特点;阐述了柠檬酸盐-酒石酸盐镀铜需要考虑和解决的问题。
- Abstract:
- Information for non-cyanide copper plating processes,including nickel pre-plating,acidic copper pre-plating,copper immersion,pyrophosphate copper plating,HEDP(1-hydroxyethylidene-1,1-diphosphonic acid) bath copper plating,ethylenediamine bath copper plating,EDTA bath copper plating,cuprous ions bath copper plating and citrate/tartrate bath copper plating,were introduced,and characteristics of the above processes were stated.Problems need to be considered and solved in citrate/tartrate bath copper plating were also proposed.
备注/Memo
国家自然科学基金项目(No.21021002) 国家重点基础研究发展计划(No.2009CB930703)资助 福建省科技计划创新资金项目(闽科计[2013]14号) 福建省经贸委企业技术创新专项资金(闽经贸计财[2011]702号)
更新日期/Last Update:
2019-06-07