PDF下载 分享
[1]刘仁志.电子的量子跃迁[J].电镀与精饰,2020,(8):34-38.[doi:10.3969/j.issn.1001-3849.2020.08.0070]
 LIU Renzhi*.Quantum Transition of Electrons[J].Plating & Finishing,2020,(8):34-38.[doi:10.3969/j.issn.1001-3849.2020.08.0070]
点击复制

电子的量子跃迁

参考文献/References:

[1] 刘仁志. 轻量化和微型化时代的电镀技术[J]. 表面工程与再制造, 2019, 2:17-18.
Liu R Z. Electroplating technology in the era of lightweight and miniaturization[J]. Surface Engineering and Remanufacturing, 2019, 2: 17-18.
[2] 魏子栋. 量子电化学进展[C]. 广州:第十三次全国电化学会议, 2005.
Wei Z D. Progress of quantum electrochemistry[C]. Guangzhou:Proceedings of the 13th National Electrochemistry Conference, 2005.
[3] 博克里斯. 量子电化学[M]. 哈尔滨:哈尔滨工业大学出版社, 1988.
Berkis J O M. Quantum electrochemistry[M]. Harbin: Harbin University of Technology Press, 1988.
[4] 刘仁志. 微扰-电极过程中的隐因子[C]. 上海:电子电镀学会年会, 2017.
Liu R Z. Hidden factors in perturbation electrode process[C], Shanghai:Proceedings of the Annual Meeting of Electronic Plating Society, 2017.

备注/Memo

收稿日期: 2020-04-29;修回日期: 2020-06-04
通讯作者: 刘仁志,Email:taso@vip.sina.com

更新日期/Last Update: 2020-08-10