YUAN Quan,QIU Yuan*,GAO Jing,et al.Research About HEDP Copper Plating on 45 Steel Surface[J].Plating & Finishing,2020,(10):17-20.[doi:10.3969/j.issn.1001-3849.2020.10.0040]
45钢表面HEDP镀铜研究
- Title:
- Research About HEDP Copper Plating on 45 Steel Surface
- Keywords:
- 45 steel HEDP copper plating properties
- 文献标志码:
- A
- 摘要:
- 本文研究了羟基乙叉二膦酸（HEDP）镀铜工艺在45钢表面得到的铜镀层的性能，考察了铜镀层的结合力、孔隙率以及深镀能力等各项性能指标。结果表明，HEDP镀铜工艺在45钢表面沉积得到的铜镀层均匀致密，镀层未出现起皮、鼓泡或脱落的现象，且镀层厚度在37~40 μm时孔隙率为零。弯曲法检测结果表明铜镀层与基体之间具有良好的结合力，即使基体材料完全断裂铜镀层也未脱落。深镀能力考察结果表明，对于内孔直径为10 mm的通孔和盲孔零件，此工艺方法的深镀能力能够满足内孔表面的镀覆要求。在5个给定的镀层厚度范围内，HEDP镀铜工艺能够很好地控制镀层厚度，具有良好的工艺控制能力，且铜镀层与底漆或密封剂之间具有良好的结合力。研究结果表明，采用HEDP镀铜工艺在45钢表面能够得到满足相关标准和产品质量要求的铜镀层。
- Abstract:
- In this paper, the performance of the copper plating obtained on the surface of 45 steel by hydroxy ethyldiphosphonic acid （HEDP） copper plating process was studied, and the binding force, porosity and deep plating ability of copper coating were investigated. The results showed that the copper coating deposited by HEDP process on 45 steel surfaces was uniform and dense, and the coating did not appear peeling, bubbling or falling off, and the porosity was zero when the thickness of the coating was 37-40 μm. The results of bending test showed that there was a good bonding force between the copper coating and the substrate, even if the substrate material was completely broken, the copper coating did not fall off. The results also showed that the deep plating ability of this process can meet the plating requirements of inner hole surface for through hole and blind hole parts with inner hole diameter of 10 mm. Within five given coating thicknesses, the HEDP copper plating process provided excellent control of coating thickness, showing a good process control ability, and good adhesion between the coating and the primer or sealant. According to the research conclusion above, the copper plating can meet the relevant standards and product quality requirements on the surface of 45 steel by HEDP copper plating process.
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备注/Memo
收稿日期： 2020-02-24；修回日期： 2020-03-28
通信作者： 邱媛， email:qiuyuan0526@163.com