XING Qianfeng,GUO Zhongning*,LUO Hongping.Research on the Process of Electroforming Copper in Polymer Medium[J].Plating & Finishing,2021,(12):34-37.[doi:10.3969/j.issn.1001-3849.2021.12.007]
高聚物介质中电沉积铜的试验研究
- Title:
- Research on the Process of Electroforming Copper in Polymer Medium
- Keywords:
- PAM high polymer electrodeposition
- 文献标志码:
- A
- 摘要:
- 采用扫描电子显微镜和X射线衍射技术研究以聚丙烯酰胺（PAM）为高分子聚合物介质对硫酸盐镀铜电沉积行为的影响。结果表明，与传统工艺相比，以聚丙烯酰胺为高聚物介质电沉积铜能在较低电压下获得更均匀致密的铜晶粒。在1.0 V电压下，镀层表面主要呈橄榄型锥状，铜镀层的（220）晶面的生长减弱，（111）晶面的生长则增强。
- Abstract:
- In this paper, scanning electron microscope and X-ray diffraction techniques were used to study the influence of polyacrylamide （PAM） as the polymer medium on the electrodeposition behavior of sulfate copper plating. The results showed that compared with the traditional process, the use of PAM as the polymer medium for copper electrodeposition could obtain more uniform and dense copper crystal grains at a lower voltage. Under 1.0 V voltage, the surface of the plating layer was mainly olive-shaped cone, the growth of the （220） crystal plane of the copper plating layer was weakened, and the growth of the （111） crystal plane was enhanced.
参考文献/References:
[1] 麦永发,朱宏,林建云,等.阳离子聚丙烯酰胺的重要研究技术进展[J]. 高分子通报,2012(8):105-110.
Mai T F, Zhu H, Lin J Y, et al. Important technical progresses of cationic polyacrylamide[J]. Polymer Bulletin, 2012(8): 105-110 (in Chinese).
[2] Fabian C P, Ridd M J, Sheehan M E, et al. Modeling the charge-transfer resistance to determine the role of guar and activated polyacrylamide in copper electrodeposition [J]. Journal of the Electrochemical Society, 2009, 156(10): D400-D407.
[3] 辜敏,杨防祖,黄令,等.高择优取向铜镀层的电化学形成及其表面形貌[J]. 物理化学学报, 2002(11):973-978.
Gu M, Yang F Z, Huang L, et al. The formation of copper electrodeposits with highly preferred orientation and their surface morphology[J]. Acta Physico-Chimica Sinica, 2002(11): 973-978 (in Chinese).
备注/Memo
收稿日期： 2019-12-18；修回日期： 2020-03-19
作者简介： 邢乾锋（1994-），硕士研究生，研究方向为特种加工技术，E-mail： 675936684@qq.com
*通信作者： 郭钟宁，教授，博士生导师，E-mail： znguo@gdut.edu.cn
基金项目： 国家自然科学基金（51575113）